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ADVANCED MICROELECTRONICS AND SMT ASSEMBLY

STATE OF THE ART FACILITY IN SILICON VALLEY

ENGINEERING PROCESS DEVELOPMENT

FOCUS ON AUTOMOTIVE/LiDAR AND MEDICAL TECHNOLOGIES

AUTOMATED DISPENSE AND ENCAPSULATION

GLOB TOP, DAM & FILL, UNDERFILL, UV

PROTOTYPE TO PRODUCTION DRIVEN BY AUTOMATION

HETEROGENEOUS ASSEMBLY WITH SMT, FLIP-CHIP, AND COB

QUALITY IS AT THE FOREFRONT OF EVERYTHING WE DO

EXCELLENT DOCUMENTATION, 3D AOI, XRAY AND METROLOGY

About Us

AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide ADVANCED MANUFACTURING for high complexity next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square foot cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.

Full Automation for ADVANCED MICROELECTRONICS with Die-Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.

Full automation for ADVANCED SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP and Flip Chip components on PCB, Rigid-Flex, Flex and Ceramic substrates.

Our Services

Full Automation for ADVANCED MICROELECTRONICS and ADVANCED SMT ASSEMBLY. We specialize in high complexity next generation microelectronic assemblies with SMT, Flip-Chip, Die-Attach and Wire Bond on PCB, Rigid-Flex and Flex substrates.

ADVANCED MICROELECTRONICS (Cleanroom)

ADVANCED SMT ASSEMBLY (RoHS/Non-RoHS)

DIE ATTACH and FLIP CHIP

  • DATACON 2200 EVO Plus.
  • Die-Attach, Flip-Chip and Multi-Chip.
  • Die Pick: Wafer, Waffle-Pack & Gel-Pak.

ADVANCED MICROELECTRONICS

  • Heterogeneous Assembly.
  • SMT, Flip-Chip, Die-Attach and Wire Bond.
  • PCB, Rigid-Flex and Flex substrates.

WIRE BONDING

  • KNS Ultra Fine Pitch Ball Bonders.
  • HESSE Fine Pitch Wedge Bonders.
  • YES G1000 Plasma Cleaning System.

ADVANCED SMT ASSEMBLY

  • YAMAHA Automation for SMT Assembly.
  • HELLER Convection Reflow Ovens.
  • 01005, BTC, BGA, uBGA, CSP, Flip Chip.

DISPENSE and ENCAPSULATION

  • ASYMTEK Precision Dispense.
  • Auger Pump and JET capability.
  • Glob Top, Dam & Fill, Underfill, UV.

PROCESS ENGINEERING

  • “Hands-On” Engineering Team.
  • Multiple processes and materials.
  • An extension of your R&D Team.

BOND TEST and METROLOGY

  • DAGE Wire Bond Pull (DPT/NDPT).
  • Die Shear and Ball Shear Test.
  • MICRO-VU Precision Measuring System.

QUALITY and DOCUMENTATION

  • YESTECH 2D + 3D Automated Inspection.
  • YXLON-FeinFocus 160 kV XRAY System.
  • Excellent Documentation.

Mission

AmTECH MICROELECTRONICS, INC. is a community of talented and experienced employees who are committed to building and motivating a team of employees who share our vision, values and high standards. We are “The Solution”, with a reputation for superior people, quality and cost effective “Automated” Technology.

Markets

Automotive/LiDAR
Automotive/LiDAR
Medical/Biotech
Medical/Biotech
RF Wireless/Microwave
RF Wireless/Microwave
Aerospace/Defense
Aerospace/Defense
Life Sciences/Healthcare
Life Sciences/Healthcare
Communications/Photonics
Communications/Photonics

Contact Us

AmTECH Contact Form

13 + 13 =

485 Cochrane Circle, Morgan Hill, CA 95037

Phone: (408) 612-8888

E-mail: info@amtechmicro.com