About Us

AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide Manufacturing Services for high complexity, next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square foot cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.

Full Automation for MICROELECTRONICS and ADVANCED PACKAGING including, Die Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.

Full Automation for SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP, and Flip Chip components on PCB, Rigid-Flex and Flex substrates.

Our Services

Full Automation for MICROELECTRONICS, ADVANCED PACKAGING and SMT ASSEMBLY. We specialize in high complexity, next generation microelectronic assemblies with SMT, Flip-Chip, Die-Attach and Wire Bonding on PCB, Rigid-Flex and Flex substrates.

 MICROELECTRONICS (Cleanroom)

SMT ASSEMBLY (RoHS/Non-RoHS)

DIE ATTACH and FLIP CHIP

  • DATACON 2200 EVO Plus.
  • Die Attach, Flip Chip and Multi-Chip.
  • Die Pick: Wafer, Waffle Pack & Gel-Pak.
PROTOTYPE to PRODUCTION

  • SMT ASSEMBLY with YAMAHA Automation.
  • HELLER Convection Reflow Ovens.
  • AQUAKLEAN Typhoon Inline Cleaner.

 

WIRE BONDING

  • KNS Ultra Fine Pitch Ball Bonders.
  • HESSE Fine Pitch Wedge Bonders.
  • YES G1000 Plasma Cleaning System.
NEW PRODUCT INTRODUCTION (NPI)

  • Complex next generation Microelectronic
  • Assemblies. Miniature products with
  • SMT, Flip Chip, Die Attach and Wire Bonding.

 

DISPENSE and ENCAPSULATION

  • ASYMTEK Precision Dispense.
  • Auger Pump and JET capability.
  • Glob Top, Dam & Fill, Underfill, UV.
PROCESS DEVELOPMENT

  • Advanced Packaging and SMT Assembly.
  • Process Engineering on-site.
  • An extension of your R&D Team.

 

BOND TEST and METROLOGY

  • DAGE Wire Bond Pull (DPT/NDPT),
  • Die Shear and Ball Shear Test.
  • MICRO-VU Precision Measuring System.
QUALITY

  • YESTECH Automated Optical Inspection.
  • YXLON-FeinFocus 160 kV XRAY System.
  • IPC-A-610, Class 2 and Class 3.

Mission

AmTECH MICROELECTRONICS, INC. is a community of talented and experienced employees who are committed to building and motivating a team of employees who share our vision, values and high standards. We are “The Solution”, with a reputation for superior people, quality and cost effective “Automated” Technology.

Markets

  • Medical/Biotech

  • Aerospace/Defense

  • RF Wireless/Microwave

  • Automobile/LiDAR

  • Communications/Photonics

  • Life Sciences/Healthcare

Contact Us



485 Cochrane Circle, Morgan Hill, CA 95037
Phone: (408) 612-8888
Email: info@amtechmicro.com