Microelectronics Assembly

PCB and RF Assembly


AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from design for manufacturing and process development of Hybrid Circuits, Multi-Chip Modules (MCM), 2.5D & 3D Heterogeneous Integration, Chip-On-Board (COB), Chip-On-Flex (COF), PCB and RF Assembly. AmTECH processes include, flip chip C4 & TCB, die attach, wire  bonding, ribbon bonding, dispense & encapsulation, and Surface Mount Technology (SMT).

AmTECH’s teamwork experience started in the early 1990’s designing and manufacturing hundreds of these electronic devices, combining multiple materials, components, assembly technologies and manufacturing processes on Rigid & Flex PCB laminates, and ceramic substrates.

AmTECH’s “hands-on” engineering team, skilled manufacturing technicians and experienced assembly operators solve manufacturing challenges and accelerate time-to-market for each product we assemble. These products require high levels of value-added engineering, laser-focus attention to detail, and state-of-the-art automated equipment.

  • Microelectronics Assembly: Full automation for Flip Chip C4 & TCB, Die Attach, Multi-Chip, Wire Bonding, and Encapsulation.
  • PCB and RF Assembly: Full automation for SMT Assembly, Chip-On-Board (COB) and Chip-On-Flex (COF).