Design Guidelines

A well designed and fabricated Rigid & Flex PCB laminate, or ceramic substrate is required for optimum manufacturing assembly yields, reliability and electrical performance. The PCB Assembly market is trending fast to ultra-small microelectronics and semiconductor industry standards.

Microelectronics Assembly with precision placement of SMD, flip chip and bare dice require tight tolerances on the substrate: PCB Fabrication with ≤10% over etching on traces and pads, solder mask alignment tolerance ≤+/-30um, solder mask thickness ≤15um and warpage (bow and twist) ≤0.150mm per 25.4mm.

Precision Die Attach

  • Die Attach Pad size.
  • Automated Die Attach.
  • Manual Die Attach.

Flip Chip and Underfill

  • Flip Chip C4 & TCB Pad Design.
  • Flip Chip Automated Assembly.
  • XRAY Inspection and Underfill.

Fine Pitch Wire Bonding

  • Gold Ball Wire Bonding.
  • Aluminum & Gold Wedge Wire Bonding.
  • Wire Bond Pull Test (DPT).

Dispense and Encapsulation

  • Glob Top overlap and height.
  • Dam & Fill width and height.
  • Fiducial dimensions.