DIE ATTACH GUIDELINES

Die Attach: Pad Size vs. Die Size

Document Die Size Die-Attach Pad Size
Comply with
MIL-STD-883
L x W D/A Pad Length ≥ L+ 500 um (20mil)
D/A Pad Width ≥ W + 500 um (20mil)
Do not comply with
MIL-STD-883
L x W D/A Pad Length ≥ L+ 250 um (10mil)
D/A Pad Width ≥ W + 250 um (10mil)

Precision Die Attach: Datacon EVO Plus

Description Standard Production
XY Placement +/-7um to +/-15um (0.3-0.6 mils) accuracy
Theta Placement +/-0.15° accuracy
Max. Die Tilt <1.0mm die size = 12um, ≥1.0mm die size = 25um
Die Attach Fiducial 3x Round pad, ≥300um (12 mils), typical 500um
Bond Line Thickness BLT = 25-50um (1-2mil)
Die Size 200um² to 50mm² (8 mils² to 2”)
Die Thickness 100um to 750um (4mils to 30mils)
Die pick from: Wafer, Waffle Pack or Gel-Pak
Die place to: Rigid, Flex, Rigid-Flex PCB or Ceramic substrate
Visual Inspection 30x to 60x magnification

Manual Die Attach: Vacuum wand under microscope

Description Standard Production
XY Placement +/-50um to +/-100um (2-4 mils) accuracy
Theta Placement +/-5° accuracy
Max. Die Tilt <1.0mm die size = 25um, ≥1.0mm die size = 50um
Bond Line Thickness BLT = 25-50um (1-2mil)
Die Size 200um² to 50mm² (8 mils² to 2”)
Die Thickness 100um to 750um (4mils to 30mils)
Die pick from: Wafer (4”-12”), Waffle Pack or Gel-Pak
Die place to: Rigid, Flex, Rigid-Flex PCB or Ceramic substrate
Visual Inspection 30x to 60x magnification