PCB DESIGN GUIDELINES

PCB Assembly Documentation

  • PCB Gerber Files, including PCB Fab drawing, notes, and panel drawing.
  • PCB Assembly Drawing, including Assembly notes and solder type.
  • Bill of Materials with part number, designator, description and manufacturer.
  • Technical Data Sheet for key components including Flip Chip and Die.
  • Pick & Place Data: XY Centroid Data, and Theta Rotation.

PCB Gold Plating for SMT and Wire Bonding

IPC-4556 ENEPIG Gold Ball or Wedge Wire Bonding
3rd level Gold ≥0.1 um (≥ 4 uinches) Immersion Gold
2nd level Palladium 0.05 – 0.30 um (2 – 12 uinches) Electroless Palladium
1st level Nickel 3-6 um (118 – 236 uinches) Electroless Nickel
IPC-4552 ENIG Aluminum Wedge Wire Bonding
2nd level Gold ≥0.05 um (≥ 2 uinches) Immersion Gold
1st level Nickel 3-6 um (118 – 236 uinches) Electroless Nickel

Panel Dimensions, Borders and Tooling Holes

Description Recommended Dimensions
Panel Size SMT ≤ 200x200mm (8”x8”) to ≤ 400x400mm (16”x16”)
Thickness SMT 1.0mm to 4.0mm (40-160mil)
Panel Size Micro-SMT ≤ 100x100mm (4”x4”) to ≤ 200x200mm (8”x8”)
Thickness Micro-SMT 0.3mm to 0.8mm (12-31 mils)
Panel Size Flex ≤ 50x50mm (2”x2”) to ≤ 100x100mm (4”x4”)
Thickness Flex 0.1mm to 0.2mm (4-8 mils)
Panel Borders (2-sides) ≥10mm width Borders (≥400 mils)
Tooling Hole diameter 3mm (120 mils) non-plated hole (3-holes)

Fiducial Marks

Description Recommended Dimensions
Global – Panel Fiducial 1.5mm (1.0–1.5mm) solid filled circle (Qty=3)
Image – Board Fiducial 1.0mm (0.5-1.0mm) solid filled circle (Qty=3)
SMT Component Fiducial 0.50mm (0.3-0.5mm) solid filled circle (Qty=3)
COB Component Fiducial 0.30mm (0.3-0.5mm) solid filled circle (Qty=3)
Solder Mask Opening Fiducial diameter plus 0.5mm (20mil)

SMD Passive Land Pattern

Components Dimensions Land Pattern
INCHES METRIC L (mm) W (mm) X (mm) Y (mm) C (mm)
009005 03015 0.30 >0.15 0.20 0.20 0.30
01005 0402 0.40 0.20 0.25 0.25 0.40
0201 0603 0.60 0.30 0.45 0.45 0.60
0402 1005 1.00 0.50 0.70 0.70 1.00
0603 1608 1.60 0.80 1.00 1.00 1.60
0805 2012 2.00 1.25 1.20 1.45 2.00
1008 2520 2.50 2.00 1.20 2.20 2.50
1206 3216 3.20 1.60 1.40 1.80 3.00
1210 3225 3.20 2.50 1.40 2.70 3.00
1806 4516 4.50 1.60 1.60 1.80 4.20
1812 4532 4.50 3.20 1.60 3.40 4.20
1825 4564 4.50 6.40 1.60 6.60 4.20
2010 5025 5.00 2.50 1.60 2.70 4.70

CSP Land Pattern

Ball/Bump Pitch
um (mil)

Ball/ Bump Size um

PCB Pad
Size um

PCB Pad Size
Variation

500um (20mil) 250-275um 275um (11mil) 250-275um
450um (18mil) 225-250um 250um (10mil) 225-250um
400um (16mil) 200-220um 220um (9mil) 200-220um
350um (14mil) 175-190um 190um (7.5mil) 175-190um
300um (12mil) 150-165um 165m (6.5mil) 150-165um