MICROELECTRONICS ASSEMBLY

Microelectronics assembly and IC packaging involve a variety of different complex processes including, flip chip, die bonding, wire bonding, and encapsulation.

Flip Chip Bonding

There are many forms of flip chip bonding, including control collapsed chip connection (C4), and Cu pillar with thermocompression and thermosonic bonding processes. The use of these processes is dependent on the application and package design of every customer’s unique requirement. To learn more about our flip chip bonding capabilities follow the link below to one of our process pages:

• Flip Chip Process

Die Bonding

There are many forms of die attach, including epoxy die attach, eutectic die attach, and silver sintering. The use of these processes is dependent on the application and package design of every customer’s unique requirement. To learn more about our die attach capabilities follow the link below to one of our process pages:

• Die Bonding Process

Wire Bonding

At AmTECH Microelectronics, we are proud to support a variety of wire bonding processes. These include, gold ball wire bonding, gold & aluminum wedge wire bonding, and heavy wire bonding & ribbon bonding for RF and power applications. To learn more about these services follow the link to one of our wire bonding process pages:

• Wire Bonding Process

Encapsulation

Encapsulation is a very important step in microelectronics assembly. Our dispensing capabilities include glob top encapsulation, dam and fill encapsulation, UV clear encapsulation, and we also have underfill capabilities for flip chip applications, to compensate for coefficient of thermal expansion (CTE) on different materials. To learn more about our encapsulation capabilities follow our link to the encapsulation process page:

• Encapsulation Process