Flip Chip (C4), is a method of interconnecting IC chips with solder balls/ bumps that have been deposited onto the top side IC chip bond pads to a substrate. Flip Chip requirements of 150um to 250 um pitch. Solder balls/ bumps are eutectic (Sn63Pb37) or lead free (SAC305).

Flip Chip (Cu Pillar), is a method of interconnecting IC chips with fine pitch copper pillar. It is often recommended for high frequency applications with compact dimensions and 30um to 130um pitch, enabling higher I/O counts, short interconnection paths and small form factor.

Underfill is applied to the stand-off distance between the flip chip die and substrate with a non-conductive adhesive after the flip chip die is connected. Underfill provides stress relief, robustness, and moisture protection.

Learn more about the Die Bonding Process.

Flip Chip Capabilities

• Flip chip bonding (face down): thermocompression and thermo-ultrasonic
• Die bonding (face up): epoxy, eutectic and sintering bonding.
• 2D, 2.5D and 3D IC packaging (stacking), heterogeneous integration.
• Chip on Board, Flex, Glass, Ceramic: COB, COF, COG, COC.
• Wafer level packaging: FOWLP, W2W, C2W.
• Flip Chip bonding and die bonding placement accuracy +/- 3um.
• Flip Chip (Cu Pillar) 30um to 130um pitch and (C4) 150um to 250um pitch.
• Component size: 0.10mm x 0.10mm to 50mm x 50mm, height up to 10mm.
• Substrate size: 300mm x 300mm, height up to 20mm.
• Underfill automated dispensing for BGA, CSP and flip chip components.