AmTECH’s capabilities include 3D Automated Optical Inspection (AOI), XRAY Inspection, Metrology, 3D Digital Microscope and Bond Test equipment for precision measurements, inspection and verification of Microelectronics and PCB Assembly.

3D High-Res Automated Optical Inspection for PCB Assembly Inspection of part defects, lead defects and solder defects.
160Kv XRAY Inspection is used for inspection and void analysis of all uBGA, WLCSP, and Flip Chip components.
Metrology Equipment is used to verify component placement accuracy and critical dimensions of PCBs and Ceramic substrates.
3D Digital Microscope with 4K Fully Integrated head, zoom from 20x to 2500x, and advanced 2D & 3D Measurement capability.
Bond Test is a requirement in Microelectronics Assembly to test the integrity of wire bonds and the die attach process.

3D High Resolution Automated Optical Inspection (AOI)

  • 12-Megapixel top-down camera and four 20-Megapixel side view cameras.
  • Advanced 2D+3D  (7um) resolution, minimum component size 01005.
  • Maximum Inspection Area: L610 mm x W610 mm (24”x24”).
  • Part Defects: position, missing, wrong, polarity, skew, tombstone.
  • Lead Defects: bent, lifted, bridging.
  • Solder Defects: open, short, insufficient, solder balls.

Microfocus 160Kv XRAY Inspection

  • SMT, Micro-SMT and Advanced Microelectronics assembly inspection.
  • Bottom Termination Components: QFN, LGA, uBGA, WLCSP, Flip Chip.
  • Extended Flip Chip, WLCSP and uBGA inspection including void analysis.
  • 2,000x geometric magnification and 17,500x total image magnification.
  • Open X-Ray tube with 25-160 kV voltage range, and <1 um detectability.
  • Oblique Viewing +/-70⁰ (140⁰) without loss of magnification.

Metrology for precision measurements

  • Programmable Zoom Lens and motorized X, Y, and Z linear ways.
  • XY=2.6um+L/175, Z=3.0um+L/150 accuracy, 315x315x160mm work area.
  • Camera and Optics: High-Res Color, with Zoom Range 36:1 (15x-540x).
  • InSpec Metrology Software: point & click, with proprietary edge detection.
  • Advanced Illumination: Multi-Ring LED Lighting, Surface, Profile and Axial.
  • LSM-1 Laser Probe System with Diffuse and Specular reflection modes.

3D Ultra High Accuracy Digital Microscope 

  • 1/1.7-inch, 12.22-megapixel 4K CMOS imaging sensor.
  • XY stage movement range +/-50mm, 233 x 185 mm XY stage size.
  • 100 x 100 mm 3D image stitching with XYZ stage and Z motorized focus.
  • 4K Fully Integrated (FI) head with automatic zoom from 20x to 2500x.
  • Advanced 2D and 3D measurements including surface roughness.
  • Contamination analysis compliant with ISO 16232 and VDA 19.

Bond Test: Wire Bond, Die Shear and Ball Shear

  • Wire Bond Pull Test (DPT and NDPT) with WP100G Test Cartridge.
  • Die Shear Test with DS100KG Test Cartridge.
  • Ball Shear Test with BS5KG Test Cartridge.
  • Test results can be saved directly to MS Excel, Word or Adobe Acrobat.
  • Graphs can be exported to JPG, TIF, PNG or BMP formats.
  • Software for Statistical Process Control (SPC) and Data Analysis.