AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.
Inspection/ Metrology
AmTECH uses key performance indicators (KPIs) to measure, assess and tract the performance of our quality and to help us identify areas for improvement. Our team is equipped with bar code labels, scanners and laser marking equipment to enhance traceability. Furthermore, AmTECH uses “best in-class” inspection tools and metrology such as 3D automated optical inspection (AOI), 160Kv XRAY, 3D digital microscope, 3D optical profilometer, and wire bond test equipment. These tools help us ensure your products specifications are met and assist us in identifying and understanding any potential failure modes.
3D Automated Optical Inspection (AOI)
Part Defects: missing, wrong, polarity, skew, tombstone.
Lead Defects: bent, lifted, bridging.
Solder Defects: open, short, insufficient, solder balls.
160Kv XRAY Inspection
XRAY inspection and void analysis of uBGA, WLCSP and Flip Chip.
XRAY inspection for 25%-33% solder ball collapse, head in pillow.
XRAY inspection for coplanarity, open, short, cold solder.
Metrology
Programmable Zoom Lens and motorized X, Y, and Z linear ways.
Camera, Optics, and Laser with automatic zoom from 15x to 540x.
Point & Click Software with proprietary edge detection.
3D Digital Microscope
4K Fully Integrated (FI) head with automatic zoom 20x to 2500x.
Advanced 2D+3D measurements including surface roughness.
Contamination analysis compliant with ISO 16232 and VDA 19.
3D Optical Profilometer
Measures surface profile, flatness, GD&T, and roughness.
Measures nearly any callout with a single device.
Easy-to-use, non-contact 3D measurement system.
Wire Bond Test
Wire Bond Pull Test with WP100G Test Cartridge.
Ball Shear Test with BS5KG Test Cartridge.