MICROELECTRONICS ASSEMBLY
AmTECH is a proven leader in microelectronics assembly and packaging. We were established over 30-years ago by a core team of Silicon Valley professionals with technical expertise in design for manufacturing and process development. We combine multiple materials, components, assembly technologies and manufacturing processes on rigid & flex PCB laminates and ceramic substrates.
Microelectronics Capabilities
- Microelectronics Assembly and Packaging.
- Flip Chip C4 and thermocompression bonding (TCB).
- Precision epoxy die attach and gold-tin eutectic die attach.
- Gold and Aluminum fine pitch wire bonding.
- RF and Power ribbon bonding.
- Glob Top, Dam & Fill and UV encapsulation.
- Precision automated underfill.
- 2D+3D AOI, XRAY, 2D+3D digital microscope and metrology.
Technology Focus
- Mixed Technology Assembly.
- Chip on Board, Chip on Flex.
- 2.5D & 3D Heterogeneous.
- Multi-Chip Modules.
- Photonics, Imaging Devices.
- MEMS, SiP, Chiplets.
- RF/ Microwave/ mmWave.
- Hybrid Circuit Technology.