PCB and RF ASSEMBLY
AmTECH provides automated PCB and RF Assembly for R&D, Prototype to Production requirements. AmTECH’s PCB Assembly capabilities can place a wide range of components with multiple assembly processes and materials on rigid & flex PCB laminates and ceramic substrates. This includes precision placement of 01005, uBGA, WLCSP and Flip Chip components.
PCB and RF Assembly Capabilities
- Automated PCB and RF Assembly.
- 01005, uBGA, WLCSP and Flip Chip C4 & TCB.
- Fine pitch SMD and bottom termination components.
- Multiple materials, components and assembly processes.
- Solder paste printing down to 150um (6 mil) circles.
- Precision SMT Pick & Place placement +/-30um accuracy.
- Reflow solder thermal profiling and ionic contamination test.
- 2D+3D AOI, XRAY, 2D+3D digital microscope and metrology.
- Mixed Technology Assembly.
- Chip on Board, Chip on Flex.
- Heterogeneous Integration.
- Multi-Chip Modules.
- Photonics, Imaging Devices.
- MEMS, SiP, Chiplets.
- RF/ Microwave/ mmWave.
- PCB & RF Assembly.