PCB and RF ASSEMBLY

AmTECH provides automated PCB and RF Assembly for R&D, Prototype to Production requirements. AmTECH’s PCB Assembly  capabilities can place a wide range of components with multiple assembly processes and materials on rigid & flex PCB laminates and ceramic substrates. This includes precision placement of 01005, uBGA, WLCSP and Flip Chip components.

PCB and RF Assembly Capabilities

• Automated PCB and RF Assembly.
• 01005, uBGA, WLCSP and Flip Chip C4 & TCB.
• Fine pitch SMD and bottom termination components.
• Multiple materials, components and assembly processes.
• Solder paste printing down to 150um (6 mil) circles.
• Precision SMT Pick & Place placement +/-30um accuracy.
• Reflow solder thermal profiling and ionic contamination test.
• 2D+3D AOI, XRAY, 2D+3D digital microscope and metrology.

Technology Focus

• Mixed Technology Assembly.
• Chip on Board, Chip on Flex.
• Heterogeneous Integration.
• Multi-Chip Modules.
• Photonics, Imaging Devices.
• MEMS, SiP, Chiplets.
• RF/ Microwave/ mmWave.
• PCB & RF Assembly.