Precision placement of components, short signal path connections, special multiple layer laminate or ceramic substrates and multiple assembly processes with solder and epoxy are important requirements for high frequency RF and microwave PCB assembly applications. This can be achieved only if manufacturers follow a tightly controlled assembly process with all the right considerations and appropriate techniques.

RF Assembly Capabilities

• Custom packaging and assembly on laminate, ceramic, or silicon substrates.
• Custom manufacturing flows including heterogeneous assembly processes.
• Precision SMT with miniature passive and bottom termination components.
• Multiple dice in a single package, laminate or ceramic substrate.
• Combination of flip chip, die bonding, wire bonding and SMT processes.
• Die to die as well as die to substrate wire bonding.
• Complex Multi-Die/ Multi-Component/ Multi-Process Hybrid Assembly.
• Experience with all types of solder and epoxies, including UV materials.

Technology Focus

• Mixed Technology Assembly.
• Chip on Board, Chip on Flex: COB, COF, COC.
• Chiplets, System in Package: SiP, MCM.
• 2D, 2.5D, 3D Heterogeneous Integration.
• RF, Microwave, mmWave Assembly.
• Photonics, Lightwave, Imaging Devices.
• MEMS, Sensors, VCSEL, Laser, PD.

To discuss your unique product requirements and discover how AmTECH may be able to help you, please contact AmTECH.