Assembly Technologies

Assembly Technologies and Manufacturing Processes on rigid and flex PCB laminates, and ceramic substrates. We have a strong engineering team to develop innovative solutions for your product development needs.

Flip Chip and Underfill

  • Flip Chip C4 and Cu Pillar TCB.
  • Thermocompression Bonding.
  • Automated Underfill.

Precision Die Attach

  • Die Attach: Epoxy, Eutectic and Sintering.
  • Automated Die Attach and Multi-Chip.
  • Die Placement +/-3um accuracy.

Fine Pitch Wire Bonding

  • Gold Ball Wire Bonding.
  • Al and Au Wedge Wire Bonding.
  • RF Ribbon Bonding.

Dispense and Encapsulation

  • Glob Top, Dam & Fill, UV, Underfill.
  • ASYMTEK Precision Dispense.
  • Auger Pump and JET capability.

SMT Assembly

  • SMT Assembly (RoHS and Non-RoHS).
  • 01005 components, uBGA, WLCSP.
  • Rigid & Flex PCB and Ceramic Substrates.