Assembly Technologies
Assembly Technologies and Manufacturing Processes on rigid and flex PCB laminates, and ceramic substrates. We have a strong engineering team to develop innovative solutions for your product development needs.
Flip Chip and Underfill
- Flip Chip C4 and Cu Pillar TCB.
- Thermocompression Bonding.
- Automated Underfill.
Precision Die Attach
- Die Attach: Epoxy, Eutectic and Sintering.
- Automated Die Attach and Multi-Chip.
- Die Placement +/-3um accuracy.
Fine Pitch Wire Bonding
- Gold Ball Wire Bonding.
- Al and Au Wedge Wire Bonding.
- RF Ribbon Bonding.
Dispense and Encapsulation
- Glob Top, Dam & Fill, UV, Underfill.
- ASYMTEK Precision Dispense.
- Auger Pump and JET capability.
SMT Assembly
- SMT Assembly (RoHS and Non-RoHS).
- 01005 components, uBGA, WLCSP.
- Rigid & Flex PCB and Ceramic Substrates.