Assembly Technologies
The traditional SMT market has been rapidly trending to ultra-small semiconductor industry requirements. There is a growing demand for leading edge technology products that require both Complex PCB Assembly and Advanced Microelectronics with SMT, Micro-SMT, Flip Chip, Die Attach, Wire Bonding, Ribbon Bonding and Encapsulation assembly technologies.
SMT and Micro-SMT
- 01005, ≥0.15mm Flip Chip, ≥0.30mm CSP.
- 3D Hi-Res AOI, XRAY and Metrology.
- X/Y Placement +/-30um accuracy.
Flip Chip and Underfill
- Flip Chip Pitch: ≥0.15mm to ≤0.30mm.
- Flip Chip Ball: ≥0.075mm to ≤0.15mm.
- XRAY Inspection and Underfill.
Precision Die Attach
- DATACON 2200 EVO Plus.
- Automated Die Attach and Multi-Chip.
- X/Y Placement +/-7um accuracy.
Fine Pitch Wire Bonding
- Gold Ball Wire Bonding (18um to 50um).
- Aluminum and Gold Wedge Wire Bonding.
- Ribbon Bonding (50x12um to 250x25um).
Dispense and Encapsulation
- Glob Top, Dam & Fill, Underfill, UV.
- ASYMTEK Precision Dispense.
- Auger Pump and JET capability.