Flip Chip (C4), is a method of interconnecting IC chips with solder balls/ bumps that have been deposited onto the top side IC chip bond pads to a substrate. The IC chip is flipped over during assembly so that its top side faces down. Solder balls/ bumps are eutectic (Sn63Pb37) or lead free (SAC305).

Flip Chip (Cu Pillar), is a method of interconnecting IC chips with fine pitch copper pillar. It is often recommended for high frequency applications with compact dimensions and 25um to 130um pitch, enabling higher I/O counts, short interconnection paths and small form factor.

Flip Chip bonding (face down): Thermocompression and Thermosonic bonding.
Die Bonding (face up): Epoxy, Eutectic and Sintering bonding.

Flip Chip Capabilities

  • Flip Chip bonding (face down) with placement accuracy down to +/- 3um.
  • Die bonding (face up) with placement accuracy down to +/- 3um.
  • Component size: 0.05mm x 0.05mm to 50mm x 50mm (0.0020” to 2.00”).
  • Substrate size: 300mm x 300mm (12” x 12”).
  • Flip Chip (C4): 130um to 300um pitch with solder balls/ bumps.
  • Flip Chip (Cu Pillar): 25um to 130um pitch with copper pillar per UCIe.
  • 2D, 2.5D and 3D IC packaging, heterogeneous integration.
  • Chip on Board, Flex, Glass, Ceramic: COB, COF, COG, COC.
  • Underfill to provide stress relief, robustness and moisture protection.
  • Microfocus 160Kv XRAY inspection and void analysis.
  • Metrology for precision measurement of substrate and assembly.