Surface Mount Technology (SMT) is the most widely used manufacturing process to produce electronic circuits in which the components are placed directly onto the surface of Printed Circuit Boards (PCBs). The traditional SMT market has been rapidly trending to ultra-small semiconductor industry requirements. There is a growing demand for Microelectronics Assemblies that require precision placement of fine pitch SMD, flip chip, bare die and bottom termination components (BTC).

The major advantages of Surface Mount Technology (SMT) over the older pin through-hole technology are much higher component density with much smaller components. Components can be easily place on top and bottom side of printed circuit boards. Surface mount technology was initially developed in the 1960s and became popular during the 1980s. By the early 1990s the PCB density and functionality increased, and the scope of applications also expanded into microelectronics assembly.

SMT Assembly Capabilities

  • Automated PCB and RF Assembly.
  • Multiple materials, components and assembly processes.
  • Fine pitch SMD and bottom termination components.
  • 01005, uBGA, WLCSP and Flip Chip C4 & TCB.
  • Solder paste printing down to 150um (6 mil) circles.
  • Precision SMT Pick & Place +/-30um accuracy.
  • Reflow solder thermal profiling and ionic contamination test.
  • 2D+3D AOI, XRAY, 2D+3D digital microscope, and metrology.