Do You Have Any Proof Of Concept or Low-Medium Volume Requirements? 

AmTECH Microelectronics, a Silicon Valley based prototype and low-to-medium-volume manufacturing services facility, is proud to now offer heavy wire bonding services. Access our years of engineering knowledge and state-of-the-art facility for exceptional reliability and efficiency. Whether you’re in renewable energy, automotive, or industrial applications, our robust manufacturing services offer unmatched performance. Our service is compatible with pressure-less silver sintering and utilizes Aluminum wedge-to-wedge bonding by way of a fully automated ultrasonic process with wire diameters from 100um to 500um (4 mil to 20 mil). Large work area 300um x 400um (12” x 16”).

Applications for Heavy Wire Bonding include:

• Power electronic & Battery cell modules
• Single semiconductors
• Si, SiC and GaN devices
• Ultrasonic wedge-wedge-bonding

Surfaces providing best weld solutions :  Aluminum, copper, gold and silver – { 50 μm – 600 μm** bond head for Al, Cu, AlCu (2 mil – 24 mil)

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Finetech announces FINEPLACER® pico 2 purchase by AmTECH Microelectronics

Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider of advanced microelectronics assembly and packaging services.

The purchase of the FINEPLACER® pico 2 will advance AmTECH’s flip chip bonding and precision die bonding manufacturing services. Designed to deliver high placement accuracy for an array of processes: flip chip bonding, precision die bonding, wafer level packaging, 2.5D and 3D IC stacking, chip-on-board (COB), chip-on-flex (COF), chip-on-glass (COG); in addition to a wide range of other assembly technologies.

Read the full article on Finetech