AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.
Custom Microelectronics Assembly and Packaging
Silicon Valley
AmTECH Microelectronics is a custom microelectronics assembly and packaging services company, based in Morgan Hill, CA. Since 1993, AmTECH has specialized in process development, design for manufacturing (DFM), and on-shore prototype to production. AmTECH’s assembly processes include: flip chip bonding, die bonding, fine and heavy wire bonding, vacuum reflow, silver sintering, dispense and encapsulation, and SMT assembly. Our facility features a fully equipped cleanroom with state-of-the-art automated equipment. AmTECH is proud to be ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, in compliance with IPC-A-610, and follows MIL-STD-883 workmanship standards.
On-Shore Manufacturing
AmTECH’s location – at the heart of Silicon Valley – offers customers the advantage of rapid turnaround times and local access to a facility with volume production. AmTECH’s strong partnerships across the San Francisco Bay Area provides an integrated one-stop solution, for taking your product from concept to market. By working with an ITAR-registered company, you can protect your intellectual property by building your product on-shore. We invite you to schedule a visit to our facility, where you can meet directly our on-site process engineers to discuss your project.
Endorsements
Mission statement
To provide excellent assembly and packaging solutions for microelectronics and photonics driven by quality, on-time delivery, and responsive communication to the customer.
Vision statement
To empower the creation of transformative technologies that redefine industries and shape the future by fostering innovation, collaboration, and sustainable practices.
Assembly and Packaging Solutions
Microelectronics Assembly
Process Development
Advanced Packaging
Flip Chip Bonding
Die Bonding
Wire Bonding
Metrology and Inspection
SMT Assembly
Markets
- Microelectronics Assembly
- Advanced Packaging
- Process Development
- Prototype Production
- Volume Production
- Metrology and Inspection
- Flip Chip Bonding
- Die Bonding
- Wire Bonding
- Encapsulation
- Vacuum Reflow
- SMT Assembly
- Defense/ Aerospace
- Telecom/ Datacom
- Photonics/ Lightwave
- Medical/ Biotech
- Power Electronics
- MEMS Sensors, Imaging
Start small. Scale quickly
Bring your product from proof of concept to market with design for manufacturing, process development, and rapid prototype to production with on-shore manufacturing.
Rapid engineering response & support
Our strong “hands-on” engineering team comes from design, process, and manufacturing backgrounds with over 50 years of combined industry experience.
TECHNOLOGY focus for different markets:
- Mixed Technology Assembly.
- Chip on Board, Flex (COB, COF).
- Hybrids Circuits on Al2O3 or AlN.
- MCM, SiP, Heterogeneous Integration.
- Microelectronics Assembly and Packaging.
- Organic and Ceramic substrates or packages.
QUICK solutions to accelerate time to market:
- Project Quotes 1-5 business days.
- SMT Assembly 3-10 business days.
- Microelectronics Assembly 3-10 business days.
- SMT plus Microelectronics Assembly 7-15 business days.
Upon receiving all documentation and materials.
