Finetech announces FINEPLACER® pico 2 purchase by AmTECH Microelectronics

Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider of advanced microelectronics assembly and packaging services.

The purchase of the FINEPLACER® pico 2 will advance AmTECH’s flip chip bonding and precision die bonding manufacturing services. Designed to deliver high placement accuracy for an array of processes: flip chip bonding, precision die bonding, wafer level packaging, 2.5D and 3D IC stacking, chip-on-board (COB), chip-on-flex (COF), chip-on-glass (COG); in addition to a wide range of other assembly technologies.