Do You Have Any Proof Of Concept or Low-Medium Volume Requirements?
AmTECH Microelectronics, a Silicon Valley based prototype and low-to-medium-volume manufacturing services facility, is proud to now offer heavy wire bonding services. Access our years of engineering knowledge and state-of-the-art facility for exceptional reliability and efficiency. Whether you’re in renewable energy, automotive, or industrial applications, our robust manufacturing services offer unmatched performance. Our service is compatible with pressure-less silver sintering and utilizes Aluminum wedge-to-wedge bonding by way of a fully automated ultrasonic process with wire diameters from 100um to 500um (4 mil to 20 mil). Large work area 300um x 400um (12” x 16”).
Applications for Heavy Wire Bonding include:
- Power electronic & Battery cell modules
- Single semiconductors
- Si, SiC and GaN devices
- Ultrasonic wedge-wedge-bonding
Surfaces providing best weld solutions : Aluminum, copper, gold and silver – { 50 μm – 600 μm** bond head for Al, Cu, AlCu (2 mil – 24 mil)