AmTECH Microelectronics https://amtechmicro.com/ Advanced Packaging & PCB Assembly Tue, 06 Jan 2026 23:58:12 +0000 en-US hourly 1 https://amtechmicro.com/wp-content/uploads/2025/02/cropped-amtechmicroelectronics-32x32.jpg AmTECH Microelectronics https://amtechmicro.com/ 32 32 SPIE Photonics West 2026 https://amtechmicro.com/spie-photonics-west/ Tue, 06 Jan 2026 23:56:03 +0000 https://amtechmicro.com/?p=259053 January 20-22, 2026

Companies offer an inside look into their portfolio of products and services. Find top suppliers, explore product and company capabilities, and build partnerships that will advance your work.

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SPIE Photonics West

Moscone Center, San Francisco CA | January 20 – 22, 2026

SPIE Photonics West is the premier event for lasers, biomedical optics, optoelectronics, and technologies supporting biophotonic, quantum, and vision applications. 

View the lineup of outstanding plenary speakers from around the globe. Select advanced training from 60 course options. Discuss your product requirements with top optics and photonics suppliers at any of the five exhibitions throughout the week, and participate in the strong industry program – this year now on three stages! The week is full of important opportunities, and we look forward to seeing you.

Conference and courses: January 17 – 22
Exhibition: January 20 – 22

View the SPIE Photonics website here.

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]]> The Argument For Indium Solder in Cryogenics & Quantum Grade Packaging https://amtechmicro.com/the-argument-for-indium-solder-in-cryogenics-quantum-grade-packaging/ Thu, 30 Oct 2025 16:42:38 +0000 https://amtechmicro.com/?p=259020 The pursuit of scalable quantum computing has increasingly turned to photonic systems as a viable pathway, leveraging the inherent advantages of light-based information processing.

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Abstract

AmTECH Team: Raynan Arcena, Jacob Rudd, Mohamed Cherif, David Chavez

The pursuit of scalable quantum computing has increasingly turned to photonic systems as a viable pathway, leveraging the inherent advantages of light-based information processing. In photonic device packaging, indium has become as a critical material for die attach due to its unique combination of softness, ductility, and low melting point [1]. Its high thermal and electrical conductivity and low melting point allow dies to be attached at low temperatures in order to avoid damaging sensitive photonic components. This makes indium suitable for applications that require precise alignment and minimal mechanical stress on optical dies.
Download the Full Paper Here

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]]> Pressure Assisted Vs Pressureless Silver Sintering https://amtechmicro.com/pressure-assisted-vs-pressureless-silver-sintering/ Tue, 28 Oct 2025 21:07:55 +0000 https://amtechmicro.com/?p=259006 Silver sintering is as a method for die attach which is used for high-power and high-frequency microelectronic devices. Silver’s material properties make it a viable material for performance in extreme applications. As device integration scales the choice between pressure assisted and pressureless sintering becomes critical.

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Abstract

AmTECH Microelectronics: Mohamed Cherif

Silver sintering is as a method for die attach which is used for high-power and high-frequency microelectronic devices. Silver’s material properties make it a viable material for performance in extreme applications. As device integration scales the choice between pressure assisted and pressureless sintering becomes critical. The pressure assisted processes allows for dense, uniform bondlines with low voiding and enhanced mechanical strength. Pressureless sintering reduces stress on fragile components and simplifies the die bonding process design resulting in compatibility across a wider range of packages. By comparing bondline morphology, thermal impedance, and die shear strength between both approaches the trade-offs become apparent with respect to performance and reliability. Additionally, by doing analysis using various characterization techniques it becomes clear that process conditions have a strong impact on joint quality. This will help guide sintering process choices based on device needs and production goals supporting the use of silver sintering in power, RF, and photonic packages.
Download the Full Paper Here

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]]> Crossing the Valley of Death in Semiconductor Packaging https://amtechmicro.com/crossing-the-valley-of-death-in-semiconductor-packaging/ Tue, 28 Oct 2025 21:02:27 +0000 https://amtechmicro.com/?p=258996 In today’s Industry 4.0 landscape, innovation is advancing at unprecedented speed, but many promising ideas still fail to scale beyond early prototypes. This critical gap, known as the “valley of death,” occurs when startups face the dual challenge of securing funding while needing access to advanced manufacturing capabilities.

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AmTECH bridges R&D innovation with scalable, sub-micron packaging for photonics, medical, neuromorphic, quantum and DoD applications.

In today’s Industry 4.0 landscape, innovation is advancing at unprecedented speed, but many promising ideas still fail to scale beyond early prototypes. This critical gap, known as the “valley of death,” occurs when startups face the dual challenge of securing funding while needing access to advanced manufacturing capabilities. Too often, companies stall at this inflection point, lacking the infrastructure to move from proof-of-concept to commercial production. AmTECH Microelectronics exists to bridge that divide by providing on-shore, state-of-the-art facilities equipped with sub-micron flip-chip placement, automated wire bonding, and soon, active alignment for next-generation products. The company’s model supports startups and innovators in transitioning from lab-fab by building pilot production lines, ensuring that great ideas are not lost to manufacturing bottlenecks.

Read the Full Article

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]]> A Comparative Analysis of Flip Chip Bonding and Active Alignment in Advanced Packaging https://amtechmicro.com/a-comparative-analysis-of-flip-chip-bonding-and-active-alignment-in-advanced-packaging/ Tue, 09 Sep 2025 23:56:58 +0000 https://amtechmicro.com/?p=258947 Flip chip bonding and active alignment are two separate techniques used in device assembly; each tailored to different performance goals.

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Precision Matters: A Comparative Analysis of Flip Chip Bonding and Active Alignment in Advanced Packaging

AmTECH Microelectronics: Mohamed Cherif and Walter Chavez

Flip chip bonding and active alignment are two separate techniques used in device assembly; each tailored to different performance goals. Flip chip is an electronic packaging method where the die is inverted so that its pads face downward and connect directly to the substrate through solder bumps. This setup minimizes interconnect length, improves signal integrity, and supports high input-output density.

Download the Full Paper Here

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]]> IMAPS Symposium 2025 https://amtechmicro.com/imaps-symposium-2025/ Thu, 26 Jun 2025 23:11:42 +0000 https://amtechmicro.com/?p=258691 The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in San Diego, California.

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IMAPS Symposium 2025

Town & Country Resort, San Diego CA | September 29 – October 2, 2025

The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in San Diego, California. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.

Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with emphasis on Advanced Package Structures (Heterogeneous Integration, HPC, AI); Advanced Interconnect, Bumping & Wirebond Technologies; RF, MEMS/Sensors, High Rel, WLCSP, Small Body FO; Enabling Materials & Advanced Equipment; and CPI, Modeling, Design, Metrology.

Conference: September 30 – October 2
Exhibition: September 30 – October 1
Professional Development Courses: September 29

All Symposium sessions will take place at the Town & Country Resort.

View the IMAPS Symposium 2025 website here.

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]]> Chiplet and Heterogeneous Integration Packaging (CHIP) https://amtechmicro.com/chiplet-and-heterogeneous-integration-packaging-chip/ Thu, 26 Jun 2025 19:10:18 +0000 https://amtechmicro.com/?p=258685 The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures.

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Chiplet and Heterogeneous Integration Packaging (CHIP)

San Jose Marriott, San Jose CA | July 7 – 10, 2025

The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures.

The program will cover the full flow: device/package architectural planning, packaging material & process technology selection, design & simulation, and device assembly and test. CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also in the automotive, industrial, enterprise, and consumer/client markets. The conference will examine the technical and commercial challenges faced, and what is being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem.

For more information about CHIP, click here.

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]]> IEEE MTT-S International Microwave Symposium https://amtechmicro.com/ieee-mtt-s-international-microwave-symposium/ Thu, 05 Jun 2025 22:39:20 +0000 https://amtechmicro.com/?p=258570 Co-located with the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG) Conference, IMS2025 offers an unparalleled platform for learning, networking, and collaboration.

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IEEE MTT-S International Microwave Symposium

Moscone Center, San Francisco, CA | June 15 – 20, 2025

Co-located with the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG) Conference, IMS2025 offers an unparalleled platform for learning, networking, and collaboration. Over the past several years, a dedicated team of volunteers has worked tirelessly to design a truly unique and enriching experience. It is both a privilege and an hon­ or to lead this team in organizing the MTT-S’s premier event.

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]]> Intern- Process/Mechanical Engineer https://amtechmicro.com/intern-process-mechanical-engineer/ Wed, 16 Apr 2025 21:15:01 +0000 https://amtechmicro.com/?p=258384 AmTECH provides Surface Mount Technology and Microelectronics / Advanced Packaging manufacturing services from Prototype to Production level volumes.

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AmTECH Microelectronics, Inc. – Morgan Hill, CA

 AmTECH provides Surface Mount Technology and Microelectronics / Advanced Packaging manufacturing services from Prototype to Production level volumes.

 We have an opening for a Summer 2025 Microelectronics Process Engineer Internship!

 Job Responsibilities

  • Assist engineering staff to develop fixtures and tooling.
  • Run programs on automated semiconductor manufacturing equipment.
  • Attend meetings with customers and learn about the microelectronics manufacturing development process.

Job Qualifications

  • Undergraduate enrolled in Mechanical Engineering program or equivalent.
  • Knowledge of material science, mechatronics, and manufacturing preferred.
  • Able to identify and remedy occupational hazards.
  • Able to make recommendations to supervisors for necessary maintenance of the facility.
  • Able to keep records, make reports, and requisition supplies as needed.
  • U.S. Citizen or Permanent Resident (We are a Government Supplier). 

Other Experience or Abilities

  • Flexible to work overtime when required.
  • Must be able to lift or carry up to 20+ pounds.
  • This position requires, walking, bending, sitting, and standing on a ladder, balance, dexterity, and visual detail.

Job Type:  Part Time

Schedule:  Monday through Thursday 8:00AM to 2:30PM.

Location:  Morgan Hill, CA

Email your resume and cover letter to rose.chavez@amtechmicro.com. Join us in shaping the future of our industry!

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]]> Sales Development Representative https://amtechmicro.com/sales-development-representative/ Wed, 16 Apr 2025 21:09:43 +0000 https://amtechmicro.com/?p=258379 Are you an experienced sales professional eager for a rewarding opportunity in a fast-growth B2B technology industry?

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Are you an experienced sales professional eager for a rewarding opportunity in a fast-growth B2B technology industry? Look no further! We are uniquely positioned to serve our target customer base, and seek a motivated and results-driven Sales Representative to help us spread the word and bring in new business while growing our existing customer base.

Key Responsibilities:

  • Establish contact with existing customers and explore new opportunities
  • Monitor industry trends to identify emerging markets and opportunities to contribute to revenue growth
  • Generate and submit regular comprehensive sales reports to management
  • Utilize all available resources to convert prospects into repeat customers
  • Collaborate with the management team to enhance marketing materials and expand our market presence
  • Attend industry trade shows to generate new leads and foster existing client relationships
  • Keep client information updated in our contact database
  • Review Customer Satisfaction Reports with a focus on quality
  • Execute customer NDA’s and attend bi-weekly progress meetings with upper management

Education and Experience:

  • Bachelor’s Degree in Business Administration or related field preferred
  • Minimum 4+ years of outside sales experience
  • Willingness to travel up to 50 percent of the time
  • Strong computer skills with expertise in spreadsheet, document, presentation, CRM software and communication tools
  • Self-motivated and comfortable working independently
  • Excellent interpersonal communication skills
  • Experience in the semiconductor, microelectronics, or SMT industries along with government contracts are a plus
  • Strong LinkedIn presence

Additional Requirements:

Safely perform essential job functions according to standards
Maintain regular, punctual attendance
Clear communication abilities
Own a car with a valid license
US citizenship or permanent US resident status
Ability to walk, bend, sit, and lift 20+ pounds

Why Join Us:

Competitive salary and commission structure
Opportunities for professional growth and development
Work in a dynamic and collaborative environment

If you’re ready to take your sales career to the next level and contribute to a company’s growth, apply now! Email your resume and cover letter to rose.chavez@amtechmicro.com. Join us in shaping the future of our industry!

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