Abstract
AmTECH Team: Raynan Arcena, Jacob Rudd, Mohamed Cherif, David Chavez
The pursuit of scalable quantum computing has increasingly turned to photonic systems as a viable pathway, leveraging the inherent advantages of light-based information processing. In photonic device packaging, indium has become as a critical material for die attach due to its unique combination of softness, ductility, and low melting point [1]. Its high thermal and electrical conductivity and low melting point allow dies to be attached at low temperatures in order to avoid damaging sensitive photonic components. This makes indium suitable for applications that require precise alignment and minimal mechanical stress on optical dies.