Chiplet and Heterogeneous Integration Packaging (CHIP)
San Jose Marriott, San Jose CA | July 7 – 10, 2025
The leading event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology … Addressing the challenges and opportunities for enabling broader adoption of chiplet architectures.
The program will cover the full flow: device/package architectural planning, packaging material & process technology selection, design & simulation, and device assembly and test. CHIPcon is a conference focused on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also in the automotive, industrial, enterprise, and consumer/client markets. The conference will examine the technical and commercial challenges faced, and what is being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem.