Abstract
AmTECH Microelectronics: Mohamed Cherif
Silver sintering is as a method for die attach which is used for high-power and high-frequency microelectronic devices. Silver’s material properties make it a viable material for performance in extreme applications. As device integration scales the choice between pressure assisted and pressureless sintering becomes critical. The pressure assisted processes allows for dense, uniform bondlines with low voiding and enhanced mechanical strength. Pressureless sintering reduces stress on fragile components and simplifies the die bonding process design resulting in compatibility across a wider range of packages. By comparing bondline morphology, thermal impedance, and die shear strength between both approaches the trade-offs become apparent with respect to performance and reliability. Additionally, by doing analysis using various characterization techniques it becomes clear that process conditions have a strong impact on joint quality. This will help guide sintering process choices based on device needs and production goals supporting the use of silver sintering in power, RF, and photonic packages.