What Is mSAP?
Modified Semi-Additive Processing (mSAP) is a fabrication approach designed to overcome the limitations of traditional etching in Printed Circuit Board (PCB) industry.
Rather than beginning with a thick copper layer and removing most of it, mSAP starts with a thin copper seed layer. Copper is then selectively plated only where circuitry is required. The result is dramatically improved line definition, finer trace geometries, and higher routing density compared with conventional subtractive methods.