Power Electronics/ RF Modules

AmTECH’s state-of-the-art equipment includes, fine & heavy wire bonding, and die bonding with epoxy, eutectic, and pressure-less silver sintering capabilities for prototype to volume production. AmTECH supports, power electronics, RF Modules, automotive/ LiDAR, and Si, SiC, GaN semiconductor devices. We offer heavy aluminum wire bonding 100 μm to 600 μm and power ribbon bonding 250um x 25um to 1000um x 100um.