Vacuum Reflow

Fluxless Eutectic Die Bonding
AmTECH’s vacuum reflow system covers a wide range of thermal vacuum applications from process performance-based R&D processing up to high-volume production. In the field of vacuum soldering our system meet highest requirements of void less soldering for Advanced Packaging and Power Electronics applications. The void-affected area can be reduced to less than 1% whereas common reflow soldering systems range at 5%.

Commonly Used Solder Alloys
We work with a wide range of solder compositions with physical properties suited to specific application requirements. Most commonly used solder alloys are 100In, SAC305, 80Au20Sn and 88Au12Ge preforms.

Surface Activation Gases
AmTECH’s vacuum soldering system allow processes under pure and oxygen-free atmospheres and provide surface activation with formic acid (HCOOH) and forming gas (N2H2) to remove surface oxides to create a clean surface. Our system is suited for 100% paste and flux, ensures fast heat-up and cool-down rates for short cycle times, and reach temperatures up to 450 °C.

Hermetic Package Seal
A hermetic seal is a critical process that creates a completely airtight and watertight barrier, preventing gases, moisture, and other contaminants from affecting the performance of sensitive electronic and mechanical systems.