ADVANCED MICROELECTRONICS AND SMT ASSEMBLY
STATE OF THE ART FACILITY IN SILICON VALLEY
ENGINEERING PROCESS DEVELOPMENT
FOCUS ON AUTOMOTIVE/LiDAR AND MEDICAL TECHNOLOGIES
AUTOMATED DISPENSE AND ENCAPSULATION
GLOB TOP, DAM & FILL, UNDERFILL, UV
PROTOTYPE TO PRODUCTION DRIVEN BY AUTOMATION
HETEROGENEOUS ASSEMBLY WITH SMT, FLIP-CHIP, AND COB
QUALITY IS AT THE FOREFRONT OF EVERYTHING WE DO
EXCELLENT DOCUMENTATION, 3D AOI, XRAY AND METROLOGY
AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide ADVANCED MANUFACTURING for high complexity next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square foot cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.
Full Automation for ADVANCED MICROELECTRONICS with Die-Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.
Full automation for ADVANCED SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP and Flip Chip components on PCB, Rigid-Flex, Flex and Ceramic substrates.
Full Automation for ADVANCED MICROELECTRONICS and ADVANCED SMT ASSEMBLY. We specialize in high complexity next generation microelectronic assemblies with SMT, Flip-Chip, Die-Attach and Wire Bond on PCB, Rigid-Flex and Flex substrates.
ADVANCED MICROELECTRONICS (Cleanroom)
ADVANCED SMT ASSEMBLY (RoHS/Non-RoHS)
AmTECH MICROELECTRONICS, INC. is a community of talented and experienced employees who are committed to building and motivating a team of employees who share our vision, values and high standards. We are “The Solution”, with a reputation for superior people, quality and cost effective “Automated” Technology.