Microelectronics Assembly and Packaging
- Die Attach, Wire Bonding, and Encapsulation
- PCB & RF Assembly, Heterogeneous Integration
- Flip Chip, SMT, COB, COF, MEMS, MCM, SiP, Chiplets
- R&D, Prototype to Production in Silicon Valley
- Design for Manufacturing, Process Development
- ISO 9001:2015, ISO 13485:2016, ITAR Registered
Microelectronics
MANUFACTURING SERVICES
PCB & RF ASSEMBLY
Engineering
Technologies
MARKETS
