AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.

Bringing Next-Generation Semiconductor Devices To Life

Most prototypes never scale. Ours do. On Shore. On Spec. On Time.

Design for manufacturing, process development, proof of concept, and low to medium volume (OSAT) semiconductor packaging in Silicon Valley.

Schedule A Consultation

Microelectronics Assembly and Advanced Packaging

AmTECH Microelectronics is a custom microelectronics assembly and packaging services company, based in Silicon Valley. AmTECH has over 30 years of experience in process development, design for manufacturing (DFM), and on-shore prototype to production. AmTECH’s assembly processes include: flip chip bonding, die bonding, fine and heavy wire bonding, vacuum reflow, silver sintering, dispense and encapsulation, and SMT assembly. Our facility features a fully equipped cleanroom with advanced, state-of-the-art automated equipment. AmTECH is proud to be ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, in compliance with IPC-A-610, and follows MIL-STD-883 workmanship standards.

Request for Quote

Contact AmTECH

Pure Play Semiconductor Packaging Solutions

Microelectronics Assembly Services

We specialize in the assembly, packaging, and interconnection of miniature electronic components, enabling our customers to achieve next-generation performance, quality, and reliability.

Assembly Includes ⮕

Advanced Packaging Services

Advanced packaging refers to a variety of packaging technologies, including Heterogeneous Integration (HI), 2.5D, 3D, Chiplets, and Co-Packaged Optics (CPO).

Services Includes ⮕

Process Development Services

Design for Manufacturing (DFM) is essential for the successful and cost-effective production of microelectronics assembly and packaging devices.

Development Includes ⮕

SMT Assembly Services

Surface Mount Technology (SMT) is the most widely used manufacturing process for producing electronic circuits, where components known as surface-mount devices are placed directly onto the surface of Printed Circuit Boards (PCBs).

Assembly Services Includes ⮕

Flip Chip Bonding Services

Flip chip bonding comes in two main forms: Controlled Collapse Chip Connection (C4) with pitch sizes from 150um to 300um and Cu Pillar with pitch sizes from 25um to 140um.

Flip Chip Services ⮕

Die Bonding Services

Die bonding is the process of attaching a semiconductor die (IC chip) to a substrate or package. Common techniques include epoxy, eutectic, and silver sintering. Each method has its advantages.

Die Bonding Services ⮕

Wire Bonding Services

AmTECH supports various processes like Au ball, Au wedge, Al wedge, gold stud bumping, and ribbon bonding for both fine and large wire diameters.

Wire Bonding Services ⮕

Metrology & Inspection Services

AmTECH uses “best in-class” metrology and inspection tools such as 3D automated optical inspection (AOI), 160Kv XRAY, 3D digital microscope, 3D optical profilometer, and wire bond test equipment.

Metrology & Inspection Services ⮕

SERVICES

Microelectronics Assembly
Advanced Packaging
Process Development
Prototype Production
Volume Production
Metrology and Inspection

PROCESSES

Flip Chip Bonding
Die Bonding
Wire Bonding
Encapsulation
Vacuum Reflow
SMT Assembly

MARKETS

Defense/ Aerospace
Telecom/ Datacom
Photonics/ Lightwave
Medical/ Biotech
Power Electronics
MEMS Sensors, Imaging

U.S. Based / Onshore OSAT Services

AmTECH’s location – at the heart of Silicon Valley – offers customers the advantage of rapid turnaround times and local access to a facility with volume production. AmTECH’s strong partnerships across the San Francisco Bay Area provides an integrated one-stop solution, for taking your product from concept to market. By working with an ITAR-registered company, you can protect your intellectual property by building your product on-shore. We invite you to schedule a visit to our facility, where you can meet directly our on-site process engineers to discuss your project.

Endorsements

AmTECH emphasizes a proactive approach to manufacturing by anticipating potential issues before they negatively impact our product quality. We are very happy with their performance throughout the years.

KLA

AmTECH consistently exceeds expectations for quality and on-time delivery, especially for our complex and unique products, indicating AmTECH is a reliable and high-quality supplier.

Broadcom

AmTECH is a significant resource for understanding and managing the design constraints associated with die bonding and wire bonding, ensuring the quality, and reliability, of our electronic devices.

Advanced Optronics

Mission statement

To provide excellent assembly and packaging solutions for microelectronics and photonics driven by quality, on-time delivery, and responsive communication to the customer.

Vision statement

To empower the creation of transformative technologies that redefine industries and shape the future by fostering innovation, collaboration, and sustainable practices.

Rapid engineering response and support

Our strong “hands-on” engineering team comes from design, process, and manufacturing backgrounds with over 50 years of combined industry experience.

Prototype Production

Start small and scale up quickly

Bring your product from proof of concept to market with design for manufacturing, process development, and rapid prototype to production with on-shore manufacturing.

Volume Production