AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.

Custom Microelectronics Assembly and Packaging

Silicon Valley

AmTECH Microelectronics is a custom microelectronics assembly and packaging services company, based in Morgan Hill, CA. Since 1993, AmTECH has specialized in process development, design for manufacturing (DFM), and on-shore prototype to production. AmTECH’s assembly processes include: flip chip bonding, die bonding, fine and heavy wire bonding, vacuum reflow, silver sintering, dispense and encapsulation, and SMT assembly. Our facility features a fully equipped cleanroom with state-of-the-art automated equipment. AmTECH is proud to be ISO 9001:2015 and ISO 13485:2016 certified, ITAR registered, in compliance with IPC-A-610, and follows MIL-STD-883 workmanship standards.

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Processes

On-Shore Manufacturing

AmTECH’s location – at the heart of Silicon Valley – offers customers the advantage of rapid turnaround times and local access to a facility with volume production. AmTECH’s strong partnerships across the San Francisco Bay Area provides an integrated one-stop solution, for taking your product from concept to market. By working with an ITAR-registered company, you can protect your intellectual property by building your product on-shore. We invite you to schedule a visit to our facility, where you can meet directly our on-site process engineers to discuss your project.

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Endorsements

AmTECH emphasizes a proactive approach to manufacturing by anticipating potential issues before they negatively impact our product quality. We are very happy with their performance throughout the years.

KLA

AmTECH consistently exceeds expectations for quality and on-time delivery, especially for our complex and unique products, indicating AmTECH is a reliable and high-quality supplier.

Broadcom

AmTECH is a significant resource for understanding and managing the design constraints associated with die bonding and wire bonding, ensuring the quality, and reliability, of our electronic devices.

Advanced Optronics

Mission statement

To provide excellent assembly and packaging solutions for microelectronics and photonics driven by quality, on-time delivery, and responsive communication to the customer.

Vision statement

To empower the creation of transformative technologies that redefine industries and shape the future by fostering innovation, collaboration, and sustainable practices.

Die Bonding

Flip Chip Bonding

Wire Bonding

SMT Assembly

Process Development

Inspection and Metrology

Processes

Flip Chip Bonding: C4 and Cu Pillar
Die Bonding: Epoxy, Eutectic, Sintering
Wire Bonding: Fine, Heavy, Ribbon
Encapsulation: Glob Top, Dam & Fill, UV
Vacuum Reflow: In, SAC305, AuSn, AuGe
SMT Assembly: RoHS and Non-RoHS
Metrology, 3D AOI, XRAY, Wire Bond Test
3D Digital Microscope, Optical Profilometer

Markets

Defense/ Aerospace
Photonics Packaging
RF/ Microwave/ mmWave
Medical/ Biotech
Power Electronics
Automotive/ LiDAR
MEMS, Sensors, Imaging
AI/ Quantum Computing

Start small. Scale quickly

Bring your product from proof of concept to market with design for manufacturing, process development, and rapid prototype to production with on-shore manufacturing.

Prototype Production