AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.

Microelectronics Assembly and Packaging

Silicon Valley

AmTECH is a custom microelectronics assembly and packaging manufacturing services company based in Morgan Hill, CA. The company specializes in process development, design for manufacturing (DFM), and prototype to production on-shore manufacturing. AmTECH’s processes include, flip chip bonding, die bonding, fine & heavy wire bonding, dispense & encapsulation, hermetic seal, vacuum reflow, and SMT assembly. In business since 1993, the company features a clean room and state-of-the-art automated equipment. The company is also ISO 9001:2015, ISO 13485:2016 certified, ITAR registered, meets IPC-A-610 Class 3, and follows MIL-STD-883 Workmanship Standards.

Request a Quote

Processes

On-Shore Manufacturing

AmTECH’s location provides flexibility for quick-turn around time and local access to a facility for volume production in Silicon Valley. The company’s strategic partnerships in the SF Bay Area provide an integrated one-stop solution for bringing your product to market. Protect your intellectual property by building your assembly on-shore with an ITAR-registered company and schedule a time to come and visit our facility and discuss your project in real-time with process engineers on-site.

Contact AmTECH

Endorsements

AmTECH emphasizes a proactive approach to manufacturing by anticipating potential issues before they negatively impact our product quality. We are very happy with their performance throughout the years.

KLA

AmTECH consistently exceeds expectations for quality and on-time delivery, especially for our complex and unique products, indicating AmTECH is a reliable and high-quality supplier.

Broadcom

AmTECH is a significant resource for understanding and managing the design constraints associated with die bonding and wire bonding, ensuring the quality, and reliability, of our electronic devices.

Advanced Optronics

Mission statement

To provide excellent assembly and packaging solutions for microelectronics and photonics driven by quality, on-time delivery, and good communication to the customer.

Vision statement

To empower the creation of transformative technologies that redefine industries and shape the future by fostering innovation, collaboration, and sustainable practices.

Die Bonding

Flip Chip Bonding

Wire Bonding

SMT Assembly

Process Development

Inspection and Metrology

Processes

Flip Chip Bonding: C4 and Cu Pillar
Die Bonding: Epoxy, Eutectic, Sintering
Wire Bonding: Fine, Heavy, Ribbon
Encapsulation: Glob Top, Dam & Fill
Vacuum Reflow: Indium, AuSn, AuGe
SMT Assembly: RoHS, Non-RoHS
Metrology, XRAY, 3D AOI, Wire Bond Test
3D Digital Microscope, Optical Profilometer

Markets

Defense/ Aerospace
Photonics
RF/ Microwave/ mmWave
Medical/ Biotech
Power Electronics
Automotive/ LiDAR
MEMS, Sensors, Imaging
AI/ Quantum Computing

Start small. Scale quickly

Bring your product from proof of concept to life with design for manufacturing, process development, and rapid prototype to production with on-shore manufacturing.

Prototype Production

Rapid engineering response & support

Our strong “hands-on” engineering team comes from design, process, and manufacturing backgrounds and has over 50 years of combined industry experience.

Volume Production