Advanced Packaging and PCB Assembly in Silicon Valley

  • Chiplets, System in Package: SiP, MCM
  • 2D, 2.5D & 3D Heterogeneous Integration
  • Chip on Board, Flex, Ceramic: COB, COF, COC
  • Process Development, Prototype to Production
  • Flip Chip C4 & Cu Pillar. SMT and RF Assembly
  • Die Bonding, Wire Bonding & Encapsulation

Advanced Packaging

SERVICES

PCB & RF ASSEMBLY

Process Development

Processes

MARKETS

Working with AmTECH Microelectronics

  • 1

    Prompt communication and attention to detail

  • 2

    Fast project quotes 1-3 days

  • 3

    Delivery 3-10 days

  • 4

    Quality that exceeds expectations

ISO 9001 QMS Certified
ISO-13485-certified-logo