Microelectronics and Advanced Packaging


AmTECH Microelectronics is a custom microelectronics assembly and advanced packaging services company located in Silicon Valley, CA. The company specializes in prototype to low-medium volume production on-shore manufacturing. AmTECH’s services include, flip chip, die bonding, wire bonding, encapsulation, and SMT assembly. In business since 1993, the company features a clean room and state-of-the-art automated equipment.

Take Your Product from Prototype to Low-Medium Volume Production

  • Process Development, Prototype to Production
  • Chip on Board, Flex, Ceramic: COB, COF, COC
  • Chiplets, System in Package: SiP, MCM
  • Die Bonding, Wire Bonding & Encapsulation
  • Flip Chip Bonding: C4 and Cu Pillar
  • SMT Assembly on Laminate and Ceramic

Microelectronics Assembly

Advanced Packaging

SMT Assembly


Prototype to Production



Working with AmTECH Microelectronics

  • 1

    Prompt communication and attention to detail

  • 2

    Fast project quotes 1-3 days

  • 3

    Delivery 3-10 days

  • 4

    Quality that exceeds expectations

ISO 9001 QMS Certified