Complex PCB Assembly and Advanced Microelectronics
- SMT, Micro-SMT & Flip Chip
- Engineering Prototype to Production
- ISO 9001:2015, ISO 13485:2016, ITAR, IPC-A-610
- Die Attach, Wire Bonding & Encapsulation
- Design and Process Engineering support
- Medical, Biotech, LiDAR, Defense, 5G, RF, mmW
Complex PCB Assembly
Assembly Technologies
Advanced Microelectronics
Quality and Compliance
Process Engineering
Market Applications
