About Us
AmTECH MICROELECTRONICS, INC. was founded in 1993, to provide ADVANCED MANUFACTURING for high complexity next generation products from “Prototype to Production”. Our Silicon Valley facility includes a 2,500 square foot cleanroom with on-site Engineering Process Development and high-quality U.S. Manufacturing.
Full Automation for ADVANCED MICROELECTRONICS with Die-Attach, Flip Chip, Multi-Chip, Gold Ball Wire Bonding, Aluminum Wedge Wire Bonding, Glob Top, Dam & Fill, Underfill, UV dispense and encapsulation.
Full automation for ADVANCED SMT ASSEMBLY with 01005, BTC, BGA, uBGA, CSP and Flip Chip components on PCB, Rigid-Flex, Flex and Ceramic substrates.
Our Services
Full Automation for ADVANCED MICROELECTRONICS and ADVANCED SMT ASSEMBLY. We specialize in high complexity next generation microelectronic assemblies with SMT, Flip-Chip, Die-Attach and Wire Bond on PCB, Rigid-Flex and Flex substrates.
ADVANCED MICROELECTRONICS (Cleanroom)
ADVANCED SMT ASSEMBLY (RoHS/Non-RoHS)
- DATACON 2200 EVO Plus.
- Die-Attach, Flip-Chip and Multi-Chip.
- Die Pick: Wafer, Waffle-Pack & Gel-Pak.
- Heterogeneous Assembly.
- SMT, Flip-Chip, Die-Attach and Wire Bond.
- PCB, Rigid-Flex and Flex substrates.
- KNS Ultra Fine Pitch Ball Bonders.
- HESSE Fine Pitch Wedge Bonders.
- YES G1000 Plasma Cleaning System.
- YAMAHA Automation for SMT Assembly.
- HELLER Convection Reflow Ovens.
- 01005, BTC, BGA, uBGA, CSP, Flip Chip.
- ASYMTEK Precision Dispense.
- Auger Pump and JET capability.
- Glob Top, Dam & Fill, Underfill, UV.
- “Hands-On” Engineering Team.
- Multiple processes and materials.
- An extension of your R&D Team.
- DAGE Wire Bond Pull (DPT/NDPT).
- Die Shear and Ball Shear Test.
- MICRO-VU Precision Measuring System.
- YESTECH 2D + 3D Automated Inspection.
- YXLON-FeinFocus 160 kV XRAY System.
- Excellent Documentation.
Mission
AmTECH MICROELECTRONICS, INC. is a community of talented and experienced employees who are committed to building and motivating a team of employees who share our vision, values and high standards. We are “The Solution”, with a reputation for superior people, quality and cost effective “Automated” Technology.
Markets
Automotive/LiDAR
Medical/Biotech
RF Wireless/Microwave
Aerospace/Defense
Life Sciences/Healthcare
