Microelectronics Assembly and Packaging

  • Die Attach, Wire Bonding, and Encapsulation
  • PCB & RF Assembly, Heterogeneous Integration
  • Flip Chip, SMT, COB, COF, MEMS, MCM, SiP, Chiplets
  • R&D, Prototype to Production in Silicon Valley
  • Design for Manufacturing, Process Development
  • ISO 9001:2015, ISO 13485:2016, ITAR Registered

Microelectronics

MANUFACTURING SERVICES

PCB & RF ASSEMBLY

Engineering

Technologies

MARKETS

ISO 9001 QMS Certified
ISO-13485-certified-logo