Flip Chip Bonding

Flip chip developed for high interconnect density has grown to be a favorite for new product development (NPI). Flip chip bonding comes in two main forms: Controlled Collapse Chip Connection (C4) with pitch sizes from >150um to 300um and Cu Pillar with pitch sizes from 30um to 150um. Both forms of flip chip involving solder balls/ bumps and a thermocompression process (heat, time, force) to create a metallic bond with the substrate.

Flip-chip Cu-pillar technology uses small, vertical copper posts (Cu pillars) with a solder bump to create interconnects between a chip and a substrate enabling high frequency applications with 30um to 150um pitch, resulting in higher I/O counts, short interconnections and smaller form factor.