AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.
Prototype Production
AmTECH’s offers value added engineering and technical expertise for custom Microelectronics Assembly and Packaging requirements.
AmTECH has expanded its manufacturing capabilities to include flip chip bonding, precision die bonding, fine & heavy wire bonding, vacuum reflow, silver sintering, dispense & encapsulation, and SMT Assembly. We support defense/ aerospace, RF/ microwave/ mmWave, medical/ biotech, LiDAR, quantum computing, MEMS, power electronics, and other industries.
New Product Introduction
Prototype quantities 5-50 pieces for new product introduction.
Process validation prior to production build.
Chip-On-Board (COB), Chip-On-Flex (COF), Chip-On Ceramic (COC).
SMT Assembly on rigid & flex laminates, and ceramic substrates.
Heavy Wire Bonding 100um to 500um and Ribbon Bonding.
Encapsulation: glob top, dam & fill, UV clear, underfill.