AmTECH’s offers value added engineering and technical expertise for custom Assembly and Packaging requirements.

AmTECH provides customers with over (30) years of leadership and experience solving process development and design for manufacturing challenges. We support next generation, leading edge technology products that require advanced manufacturing technologies such as Flip Chip, Die Bonding, Wire Bonding, Ribbon Bonding, Encapsulation, and SMT Assembly processes.

Process Development

• Custom Assembly and Packaging on laminate, ceramic, glass or silicon.
• Design and Process Development support for Assembly and Packaging.
• Custom Manufacturing Flows including heterogeneous assembly processes.
• Custom Tooling and Fixture design with Fusion 360 and Solid Works.
• Experience with all types of Solder and Epoxies, including UV materials.

Prototype to Low-Medium Production

• Prototype quantities usually 5-50 pieces for NPI, R&D, and new projects.
• Low-Volume 100 to 1K, and Medium-Volume 1K to 10K pieces per order.
• Chip-On-Board (COB), Chip-On-Flex (COF), Chip-On Ceramic (COC).
• System-in-Package (SiP) and Multi-Chip Module (MCM).
• SMT Assembly on rigid & flex laminates, and ceramic substrates.
• Flip Chip Bonding: C4 and Cu Pillar thermocompression bonding.
• Die Bonding: epoxy, eutectic, die-attach-film (DAF), silver sintering.
• Fine Wire Bonding: gold ball, aluminum & gold wedge 20um to 50um.
• Heavy Wire Bonding 100um to 500um and Ribbon Bonding.
• Encapsulation: glob top, dam & fill, UV clear, underfill.

To discuss your unique product requirements and discover how AmTECH may be able to help you, please contact AmTECH.