MICROELECTRONICS and ADVANCED PACKAGING
Microelectronics Assembly and Packaging manufacturing services in Silicon Valley. AmTECH’s team has over 30-years of experience in process development and prototype to production with leading edge technologies in a variety of applications.

Prototype to Production
- An extension of your R&D Engineering Team.
- Process development, Prototype.
- Low to Medium Volume Production.

Microelectronics Assembly (Cleanroom)
- Flip Chip, Die Bond, Wire Bond and Encapsulation.
- Chip on Board, Flex, Ceramic: COB, COF, COC.
- Photonics, MEMS, Sensors, Imaging Devices.

Advanced Packaging (Cleanroom)
- Chiplets, System in Package: SiP, MCM.
- 2D, 2.5D & 3D Heterogeneous Integration.
- Packaging with multiple dice, components, processes.

RF and Microwave Assembly
- SMT Assembly (RoHS and Non-RoHS).
- Precision assembly and packaging including SMT.
- Rigid & Flex Laminates and Ceramic Substrates.

Inspection, Metrology and Bond Test
- 2D+3D AOI & XRAY Inspection, and Void Analysis.
- Metrology and 2D+3D Digital Microscope.
- Bond Test: Wire Bond, Die Shear and Ball Shear.