Microelectronics Assembly, PCB and RF Assembly at one location in Silicon Valley. AmTECH’s team has over 30-years of experience in process development for leading edge technologies in a variety of market applications.

Microelectronics Assembly (Cleanroom)

  • Flip Chip C4 and Cu Pillar TCB.
  • Die Attach: Epoxy, Eutectic and Sintering.
  • Wire Bonding and RF Ribbon Bonding.

PCB and RF Assembly

  • SMT Assembly (RoHS and Non-RoHS).
  • 01005 components, uBGA, WLCSP.
  • Rigid & Flex PCB and Ceramic Substrates.


DFM and Process Engineering

  • An extension of your R&D Engineering Team.
  • Multiple Assembly Processes and Materials.
  • Custom Tooling and Manufacturing Flows.

Inspection, Metrology and Bond Test

  • 2D+3D AOI and 160Kv XRAY Inspection.
  • Metrology and 2D+3D Digital Microscope.
  • Bond Test: Wire Bond, Die Shear and Ball Shear.

Quality Management System (QMS)

  • Control of Documents and Records.
  • Manufacturing Process Instructions (MPI).
  • Employee Training: ISO, IPC, Microelectronics.