It is difficult in today’s market to identify a U.S. Electronics Manufacturing Services company with a strong Engineering team that offers both Complex PCB Assembly and Advanced Microelectronics at one location.

PCB Assembly (RoHS and Non-RoHS)

  • SMT and Micro-SMT Assembly.
  • Flip Chip & Underfill Assembly.
  • PCB, Flex and Ceramic Substrates.


Microelectronics Assembly (Cleanroom)

  • Precision Die Attach and Multi-Chip.
  • Fine Pitch Wire Bonding and Ribbon Bonding.
  • Glob Top, Dam & Fill, Underfill, UV.

Design and Process Engineering

  • An extension of your R&D Engineering Team.
  • Multiple Assembly Processes and Materials.
  • Custom Tooling and Manufacturing Flows.

Inspection, Metrology and Bond Test

  • 3D High-Res AOI and 160Kv XRAY Inspection.
  • Metrology and 3D High Accuracy Digital Microscope.
  • Bond Test: Wire Bond, Die Shear and Ball Shear.

Quality Management System (QMS)

  • Control of Documents and Records.
  • Manufacturing Process Instructions (MPI).
  • Employee Training: ISO, IPC, Microelectronics.