MICROELECTRONICS ASSEMBLY and ADVANCED PACKAGING

Advanced Packaging and PCB Assembly at one location in Silicon Valley. AmTECH’s team has over 30-years of experience in process development and prototype to production with leading edge technologies in a variety of market applications.

Prototype to Production

  • An extension of your R&D Engineering Team.
  • Process development, with Rapid Prototype.
  • Low to Medium Volume Production.
Wire Bonding and Ribbon Bonding

Microelectronics Assembly

  • Flip Chip, Die Bond, Wire Bond & Encapsulation.
  • Chip on Board, Flex, Ceramic: COB, COF, COC.
  • Chiplets, System in Package: SiP, MCM.

Advanced Packaging (Cleanroom)

  • Chiplets, System in Package: SiP, MCM.
  • Chip on Board, Flex, Ceramic: COB, COF, COC.
  • Flip Chip, Die Bond, Wire Bond & Encapsulation.

RF Assembly

  • SMT Assembly (RoHS and Non-RoHS).
  • RF, Microwave, mmWave Assembly.
  • Rigid & Flex Laminates and Ceramic Substrates.

Inspection, Metrology and Bond Test

  • 2D+3D AOI, XRAY Inspection and Void Analysis.
  • Metrology and 2D+3D Digital Microscope.
  • Bond Test: Wire Bond, Die Shear and Ball Shear.