MANUFACTURING SERVICES
Microelectronics Assembly, PCBA and RF Assembly at one location in Silicon Valley. AmTECH’s team has over 30-years of experience in process development for leading edge technologies in a variety of market applications.
Microelectronics Assembly (Cleanroom)
- Flip Chip C4 and Cu Pillar TCB.
- Die Attach: Epoxy, Eutectic and Sintering.
- Wire Bonding and RF Ribbon Bonding.
PCBA and RF Assembly
- SMT Assembly (RoHS and Non-RoHS).
- 01005 components, uBGA, WLCSP.
- Rigid & Flex PCB and Ceramic Substrates.
DFM and Process Engineering
- An extension of your R&D Engineering Team.
- Multiple Assembly Processes and Materials.
- Custom Tooling and Manufacturing Flows.
Inspection, Metrology and Bond Test
- 2D+3D AOI and 160Kv XRAY Inspection.
- Metrology and 2D+3D Digital Microscope.
- Bond Test: Wire Bond, Die Shear and Ball Shear.
Quality Management System (QMS)
- Control of Documents and Records.
- Manufacturing Process Instructions (MPI).
- Employee Training: ISO, IPC, Microelectronics.