Encapsulation

Dispense and Encapsulation

Our expertise in epoxy dispensing technology and materials, coupled with industry leadership, and a customer-focused approach, allows to optimize dispensing and encapsulation processes for a variety of applications. When working with liquid encapsulation materials, factors like storage temperature, shelf life, proper thawing, pot life, substrate pre-heat, cure time, and cure temperature are crucial for successful assembly, impacting material properties and overall quality.

Encapsulation processes, particularly using epoxy are crucial for protecting fragile die and wire bonds. We analyze the epoxy fluids, assembly, components, and your accuracy requirements to recommend the best process for your needs.

The non-conductive adhesive, commonly called “underfill,” is applied to the stand-off distance between the flip chip die and substrate after the die is connected, providing stress relief, robustness, and moisture protection.