DFM and Process Development

Design for Manufacturing (DFM) is essential for the successful and cost-effective production of microelectronics assembly and packaging devices.  By proactively addressing manufacturability issues during the design stage, DFM leads to faster time-to-market, reduce risk of multiple re-designs, increase use of automation, and better high-quality manufacturing yields. DFM will allow potential problems to be fixed in the design phase which is the least expensive place to address them. Depending on various types of manufacturing processes there are guidelines for DFM practices. These guidelines help to precisely define various dimensions, tolerances, rules, and manufacturing checks.

Process development in manufacturing involves optimizing and improving manufacturing processes to produce prototype and later production goods more efficiently, cost-effectively, and with greater consistency, ensuring each step is efficient, scalable, and reliable. This includes selecting components, materials, optimizing assembly and packaging processes, and developing quality control methods. These assembly processes include flip chip bonding, precision die bonding, fine & heavy wire bonding, vacuum reflow, silver sintering, dispense & encapsulation, and SMT Assembly.