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SMT Assembly
Surface Mount Technology (SMT) is the most widely used manufacturing process for producing electronic circuits, where components known as surface-mount devices are placed directly onto the surface of Printed Circuit Boards (PCBs). The traditional SMT market has been rapidly trending to ultra-small components to meet the demands of the semiconductor industry for miniaturization and increased functionality. This trend is driven by the need for smaller, more powerful, and efficient electronic devices.
Surface Mount Technology (SMT) was developed in the 1960s and popularized in the 1980s, offers significant advantages over older through-hole technology, including higher component density, smaller components, and the ability to mount components on both sides of a printed circuit boards (PCBs). This has led to increased PCB density, functionality, and expanded applications into microelectronics assembly.
SMT Assembly Capabilities
- Three fully automated SMT assembly lines.
- Mixed technology assembly with multiple assembly processes.
- SMT Assembly on rigid and flex laminates, and ceramic substrates.
- SMD, uBGA, WLCSP >300um pitch, Flip Chip >100um pitch.
- 03015mm to 50x50mm components, L100mm connectors.
- SMT Pick & Place placement accuracy of +/-25um.
- Solder paste printing down to 150um (6 mil) circles.
- Reflow solder thermal profiling and ionic contamination test.
- 3D AOI, XRAY Inspection, 3D digital microscope, and metrology.
SMT Applications
SMT Assembly on rigid organic substrates with up to 2,500 components.
SMT Assembly on flex organic substrates and ceramic substrates.
Microelectronics SMT Assembly with bottom termination components.
RoHS, non-RoHS, and low temperature solder SMT assembly.
Tin mitigation for defense and aerospace applications.
Mixed technology assembly with multiple assembly processes.