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Assembly and Packaging Processes
Microelectronics Assembly and Packaging processes on rigid & flex laminates, ceramic, glass, and silicon substrates. We have a strong engineering team for process development, and prototype to production requirements.
Flip Chip Bonding
- Flip Chip Cu Pillar: 30um to 130um pitch.
- Flip Chip C4: 150um to 250um pitch.
- Thermocompression Bonding (TCB), +/-2um.
Die Bonding
- Die Bonding: Epoxy, Eutectic and Sintering.
- Die Bonding for Multi-Chip-Modules.
- Placement Accuracy: +/-2um and +/-7um.
Wire Bonding
- Fine Wire Bonding: 0.8 mil to 2 mil.
- Heavy Wire Bonding: 3 mil to 20 mil.
- Plasma cleaning with Argon and Oxygen.
Encapsulation
- Glob Top, Dam and Fill, UV, Underfill.
- Conductive and Non-Conductive Epoxy.
- ASYMTEK Precision Dispense.
Vacuum Reflow
- Vacuum Reflow: Indium, AuSn, AuGe.
- Nitrogen, Forming Gas, Formic Acid.
- Advanced Packaging and Power Electronics
SMT Assembly
- 03015 to 50x50mm, WLCSP ≥300um pitch.
- Rigid & Flex Laminates and Ceramic Substrates.
- Placement Accuracy: +/-25um.
