ASSEMBLY and PACKAGING PROCESSES
Microelectronics Assembly and Packaging processes on rigid & flex laminates, ceramic, glass, and silicon substrates. We have a strong engineering team for process development, and prototype to production requirements.
Flip Chip Bonding
- Flip Chip C4 and Cu Pillar +/-3um.
- 2.5D and 3D IC packaging (stacking).
- Chip on Board, Flex (COB, COF).
Die Bonding
- Die Bonding: Epoxy, Eutectic and Sintering.
- Automated Die Bonding and Multi-Chip.
- Die Bonding accuracy +/-7um.
Wire Bonding
- Fine Wire Bonding: Gold and Aluminum.
- Heavy Wire Bonding: Aluminum.
- Ribbon Bonding: RF & Power.
Encapsulation
- Glob Top, Dam & Fill, UV, Underfill.
- ASYMTEK Precision Dispense.
- Auger Pump and JET capability.
SMT Assembly
- SMT Assembly (RoHS and Non-RoHS).
- 03015mm to 50x50mm, L100mm components.
- 2D+3D AOI & XRAY Inspection, and Void Analysis.