AmTECH’s Story

AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from design for manufacturing and process development of Hybrid Circuit Technology (HCT), Chip-On-Board (COB), Chip-On-Flex (COF) and Multi-Chip Modules (MCM). AmTECH’s packaging and assembly processes include: flip chip C4 & Cu Pillar, die bonding, wire bonding, ribbon bonding, encapsulation, and SMT assembly.

AmTECH’s teamwork experience started in 1993 designing and manufacturing hundreds of these electronic devices from prototype to production. We combine multiple materials, components, and assembly processes on rigid & flex PCB laminates, silicong, glass, and ceramic substrates. 

AmTECH’s “hands-on” engineering team, skilled manufacturing technicians and experienced assembly operators solve manufacturing challenges and accelerate time-to-market for each product we assemble. These products require high levels of value-added engineering, prompt communication to the customer with attention to detail, and state-of-the-art automated equipment.

  • Advanced Packaging: Full automation for Flip Chip C4 & Cu Pillar, Die Bonding, Wire Bonding, and Encapsulation.
  • PCB and RF Assembly: Full automation for SMT Assembly including 3D Hi-Res AOI, XRAY Inspection and Metrology.