AmTECH’s Story

AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from process development and design for manufacturing for Hybrid Integrated Circuits (HIC), Chip-On-Board (COB), Chip-On-Flex (COF) and Multi-Chip Modules (MCM). AmTECH’s assembly and packaging processes include: flip chip bonding, die bonding, wire bonding, ribbon bonding, encapsulation, and SMT assembly.

AmTECH’s teamwork experience started in 1993 designing and manufacturing hundreds of these electronic devices from prototype to low-medium volume production. We combine multiple materials, components, and assembly processes on rigid & flex laminates, ceramic, glass, and silicon substrates.

AmTECH’s “hands-on” engineering team, skilled manufacturing technicians and experienced assembly operators solve manufacturing challenges and accelerate time-to-market for each product we assemble. These products require high levels of value-added engineering, prompt communication to the customer with attention to detail, and state-of-the-art automated equipment.

• Microelectronics Assembly: Flip Chip Bonding, Die Bonding, Wire Bonding, and Encapsulation.
• Advanced Packaging: System in Package (SiP), Multi-Chip Modules (MCM), Heterogeneous Integration.
• SMT Assembly: Full automation for SMT Assembly including 3D Hi-Resolution AOI, XRAY Inspection and Metrology.