Power Electronics

AmTECH’s state-of-the-art equipment includes, fine & heavy wire bonding, and die bonding with epoxy, eutectic, and pressure-less silver sintering capabilities for prototype to volume production. AmTECH supports, power electronics, battery technology, automotive/ LiDAR, and Si, SiC, GaN semiconductor devices. We offer heavy aluminum wire bonding 50 μm to 500 μm and power ribbon bonding 250um x 25um to 1000um x 100um.