ADVANCED PACKAGING and MICROELECTRONICS

AmTECH is a proven leader in Advanced Packaging and Microelectronics Assembly. We were established over 30-years ago by a core team of Silicon Valley professionals with technical expertise in design for manufacturing and process development. We combine multiple materials, components, assembly technologies and manufacturing processes on rigid & flex PCB laminates and ceramic substrates.

Advanced Packaging & Microelectronics Capabilities

 

  • Flip Chip Bonding: C4 and Cu Pillar.
  • Die Bonding: Epoxy, Eutectic and Sintering.
  • Gold ball wire bonding.
  • Aluminum and Gold wedge wire bonding.
  • Ribbon bonding: RF and Power.
  • Encapsulation: Glob Top, Dam & Fill and UV.
  • Underfill to provide stress relief and robustness.
  • Anisotropic Conductive Film & Paste: ACF, ACP.
  • SMT and RF Assembly.

Technology Focus

  • Chiplets, System in Package: SiP, SoC, MCM.
  • 2D, 2.5D & 3D Heterogeneous Integration.
  • Chip on Board, Flex, Ceramic: COB, COF, COC.
  • RF, Microwave, mmWave Assembly.
  • Photonics, Lightwave, Imaging Devices.
  • MEMS and Sensors.
  • Mixed Technology PCB Assembly.