ADVANCED PACKAGING

As the demand for higher I/O, enhanced electrical performance, improved thermal characteristics, reduced signal path lengths, reduced costs increase, the progression of the field towards advanced packaging becomes more and more inevitable. At AmTECH Microelectronics, we are here to support innovation and to take your product from proof of concept to prototype and low-medium volume production.

Heterogeneous Integration

As we arrive into the next generation of assembly and packaging, the industry has introduced the concept of interconnecting multiple known-good-die (KGD), not necessarily of the same process nodes, and use of a redistribution layer (RDL) on a passive interposer which is typically made of glass, silicon, or organic material. An example of heterogeneous integrations is Intel’s embedded multi-die interconnect bridge (EMIB). Designing next-generation products takes a lot of innovation and iterations. At AmTECH Microelectronics we are excited at the opportunity to play a role in the advancement of the semiconductor ecosystem.

System-in-Package: SiP, MCM

The ability to integrate a variety of components like microprocessors, memory chips, power management ICs, sensors, and passive components into one package is a whole new concept when compared to the monolithic approach. SiP designs are becoming more and more ubiquitous and as the technology diffuses AmTECH is looking forward by continually investing in people and state-of-the-art equipment to support this new wave of technology.

To learn more about our services and capabilities please visit our process page.