AmTECH bridges R&D innovation with scalable, sub-micron packaging for photonics, medical, neuromorphic, quantum and DoD applications.
In today’s Industry 4.0 landscape, innovation is advancing at unprecedented speed, but many promising ideas still fail to scale beyond early prototypes. This critical gap, known as the “valley of death,” occurs when startups face the dual challenge of securing funding while needing access to advanced manufacturing capabilities. Too often, companies stall at this inflection point, lacking the infrastructure to move from proof-of-concept to commercial production. AmTECH Microelectronics exists to bridge that divide by providing on-shore, state-of-the-art facilities equipped with sub-micron flip-chip placement, automated wire bonding, and soon, active alignment for next-generation products. The company’s model supports startups and innovators in transitioning from lab-fab by building pilot production lines, ensuring that great ideas are not lost to manufacturing bottlenecks.