AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.

Advanced Packaging

At AmTECH, Advanced packaging refers to a variety of packaging technologies, including Heterogeneous Integration (HI), 2.5D, 3D, Chiplets, and Co-Packaged Optics (CPO). These technologies combine multiple dice (chips) with high-density interconnects into a single package, enhancing performance, reducing size, and lowering power consumption. Advanced packaging is crucial for the development of advanced AI and high-performance computing (HPC) systems, enabling breakthroughs in areas like AI accelerators and 5G/6G infrastructure.

TECHNOLOGIES for Advanced Packaging:

Integration:

Advanced packaging allows for the integration of different types of chips with multiple process nodes (e.g., processors, high bandwidth memory, specialized accelerators) into a single package, optimizing performance for specific applications.

Heterogeneous Integration:

It enables the combination of chips, packages, interposers, and substrates using a variety of assembly and packaging processes into a single package, facilitating the development of specialized AI accelerators and other systems.

2.5D and 3D Packaging:

Technologies like 2.5D (using an interposer) and 3D (vertical stacking of chips) are key aspects of advanced packaging, allowing for increased integration density and improved performance.

Chiplets Packaging:

The use of chiplets, smaller, pre-tested chip components, is a major trend in advanced packaging, allowing for more efficient and cost-effective chip design and manufacturing, especially for AI applications.

Co-Packaged Optics (CPO):

This technology integrates optical components directly with silicon chips, typically within a single package to improve bandwidth, reduce power consumption and lower latency in data centers and HPC systems.

Metrology and Quality Control:

AmTECH ensures the functionality and reliability for advanced packaging through various quality and testing procedures; including metrology, 3D AOI, XRAY, wire bond pull test, and die shear test.

AI, HPC, 5G/6G system benefits:

Higher Frequency and Performance:

Advanced packaging enables higher performance for AI accelerators, HPC systems and 5G/6G infrastructure by optimizing data transfer between chips and reducing latency.

Small Form Factor (SFF):

By integrating multiple chips into a single package, advanced packaging allows for the development of smaller and more power-efficient devices.

Lower Power Consumption:

Advanced packaging techniques can reduce power consumption by optimizing signal paths and reducing parasitic effects.

Custom Assembly and Packaging:

Custom advanced packaging allows the flexibility in integrating different technology modes and functions for the development of customized AI accelerators and other specific application needs.

MARKET Applications:

Defense and Aerospace: Radar, communications, and guidance systems.

Telecom/ Datacom: RF Microwave/ mmWave, 5G/6G, networking, and data center.

Medical/ Biotech: Implantable devices, diagnostic equipment.

Automotive/ LiDAR: autonomous self-driving, and connected car technologies.

MEMS Sensors, Imaging Devices: Smartphones, computers, wearables.

High-performance computing (HPC) and AI accelerators.

CHALLENGES:

Miniaturization Complexity:

As electronics devices continue to shrink, assembly and packaging processes must achieve higher levels of precision, reliability, and repeatability.

High-Power, Thermal Management:

Integrating multiple components within a single package can lead to increased heat generation. Dissipating heat from densely packed circuits is crucial for performance and reliability.

High-Frequency Applications:

Assembly processes must minimize signal loss and impedance mismatches for high-frequency signals.

Cost and Throughput:

Balancing cost-effectiveness with the need for fast turnaround times for prototype production, and increase use of state-of-the-art equipment for volume production.

To discuss your unique product requirements and discover how AmTECH may be able to help you!

Contact AmTECH

Request for Quote

(408) 612-8888