AmTECH Microelectronics - Quality That Exceeds Expectations. See our story.
Microelectronics Assembly
AmTECH’s expertise in Microelectronics Assembly delivers precision, reliability and repeatability needed to bring advanced leading-edge technology to life. We specialize in the assembly, packaging, and interconnection of miniature electronic components, enabling our customers to achieve next-generation performance, quality, and reliability. As a trusted partner within the electronics manufacturing services industry, AmTECH supports demanding applications in defense and aerospace, telecom/datacom, medical and biotech, power electronics and automotive, and MEMS sensors and imaging devices. Our proven capability in miniaturization, high-performance integration, and quality manufacturing helps customers accelerate innovation and confidently enter new markets.
AmTECH offers Microelectronics Assembly:
This involves directly mounting dice and other components onto an organic rigid or flex substrate, offering size reduction, and improve thermal and electrical performance.
Hybrid Circuits (Al2O3, AlN):
Our manufacturing PROCESSES include:
Flip Chip Bonding:
AmTECH uses flip chip equipment with precision placement accuracy and thermocompression bonding capability to attach a semiconductor die (chip) with C4 or Cu Pillar solder bumps to a substrate.
Die Bonding/ Die Attach:
This involves attaching a semiconductor die (or chip) to a substrate, package or interposer using epoxy, solder, or paste. AmTECH offers epoxy, eutectic, and silver sintering die bonding processes.
Wire Bonding:
We wire bond the die pads to a substrate or package with fine gold or aluminum wires using thermosonic or ultrasonic wire bonding processes. We also offer heavy wire bonding and ribbon bonding.
Surface Mount Technology (SMT):
Most common manufacturing process where components are mounted directly on printed circuits boards. SMT has been trending fast to ultra-small components to meet the demands for miniaturization.
Encapsulation/ Lid Attach:
AmTECH protects the assembled circuit from environmental factors and mechanical damage using epoxy materials for encapsulation, or lid attach with b-stage epoxy or hermetic seal.
Metrology and Quality Control:
AmTECH ensures the functionality and reliability for microelectronics assembly through various quality and testing procedures; including metrology, 3D AOI, XRAY, wire bond pull test, and die shear test.
MARKET Applications:
Defense and Aerospace: Radar, communications, and guidance systems.
Telecom/ Datacom: RF Microwave/ mmWave, 5G/6G, networking, and data center.
Medical/ Biotech: Implantable devices, diagnostic equipment.
Automotive/ LiDAR: autonomous self-driving, and connected car technologies.
MEMS Sensors, Imaging Devices: Smartphones, computers, wearables.
High-performance computing (HPC) and AI accelerators.
CHALLENGES:
Miniaturization Complexity:
As electronics devices continue to shrink, assembly and packaging processes must achieve higher levels of precision, reliability, and repeatability.
High-Power, Thermal Management:
Integrating multiple components within a single package can lead to increased heat generation. Dissipating heat from densely packed circuits is crucial for performance and reliability.
High-Frequency Applications:
Assembly processes must minimize signal loss and impedance mismatches for high-frequency signals.
Cost and Throughput:
Balancing cost-effectiveness with the need for fast turnaround times for prototype production, and increase use of state-of-the-art equipment for volume production.