The pursuit of scalable quantum computing has increasingly turned to photonic systems as a viable pathway, leveraging the inherent advantages of light-based information processing.

Silver sintering is as a method for die attach which is used for high-power and high-frequency microelectronic devices. Silver’s material properties make it a viable material for performance in extreme applications. As device integration scales the choice between pressure assisted and pressureless sintering becomes critical.

Flip chip bonding and active alignment are two separate techniques used in device assembly; each tailored to different performance goals.