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NEWS
Crossing the Valley of Death in Semiconductor Packaging
In today’s Industry 4.0 landscape, innovation is advancing at unprecedented speed, but many promising ideas still fail to scale beyond early prototypes. This critical gap, known as the “valley of death,” occurs when startups face the dual challenge of securing funding while needing access to advanced manufacturing capabilities.
Heavy Wire Bonding Bay Area
AmTECH Microelectronics, a Silicon Valley based prototype and low-to-medium-volume manufacturing services facility, is proud to now offer heavy wire bonding services.
Finetech announces FINEPLACER® pico 2 purchase by AmTECH Microelectronics
Finetech, a leading provider of precision die-bonders, announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider of advanced microelectronics assembly and packaging services.