Abstract AmTECH Team: Raynan Arcena, Jacob Rudd, Mohamed Cherif, David Chavez The pursuit of scalable quantum computing has increasingly turned to photonic systems as a viable pathway, leveraging the inherent advantages of light-based information processing. In...
Abstract AmTECH Microelectronics: Mohamed Cherif Silver sintering is as a method for die attach which is used for high-power and high-frequency microelectronic devices. Silver’s material properties make it a viable material for performance in extreme applications. As...
Precision Matters: A Comparative Analysis of Flip Chip Bonding and Active Alignment in Advanced Packaging AmTECH Microelectronics: Mohamed Cherif and Walter Chavez Flip chip bonding and active alignment are two separate techniques used in device assembly; each...
