What Is mSAP? Modified Semi-Additive Processing (mSAP) is a fabrication approach designed to overcome the limitations of traditional etching in Printed Circuit Board (PCB) industry. Rather than beginning with a thick copper layer and removing most of it, mSAP starts...
AmTECH bridges R&D innovation with scalable, sub-micron packaging for photonics, medical, neuromorphic, quantum and DoD applications. AmTECH Team: David Walter Chavez In today’s Industry 4.0 landscape, innovation is advancing at unprecedented speed, but many...
